首页> 外文会议>Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1990. Technical Digest 1990., 12th Annual >Use of two-dimensional process and device modeling to solve somereal problems in GaAs MESFET design and analysis
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Use of two-dimensional process and device modeling to solve somereal problems in GaAs MESFET design and analysis

机译:使用二维过程和设备建模来解决一些问题GaAs MESFET设计和分析中的实际问题

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A new, easy-to-use two-dimensional Poisson solver, GATES-2d, isdescribed. The program is used to address two problems that only atwo-dimensional simulator can answer: the problem of simultaneouslyminimizing short-channel effects, source resistances, and fringecapacitances in self-aligned MESFET technology, and analyzing parasiticcapacitances in recess-etched technology. Poisson's equation is solvedfor the electron concentration n(x,y)(assumed to obey Boltzmann statistics) in the presence of shallow donorsand acceptors and deep donors (EL2) and acceptors (Cr). 2D piezoelectricand surface-potential effects are included. With the results, analyticalcalculations are made of sheet resistances and saturated current atevery vertical slice. The total capacitance is computed by integratingthe electron concentration over the region simulated, and taking twicethe (half-FET) change with gate voltage
机译:一个新的,易于使用的二维泊松求解器GATES-2d正在研发中。 描述。该程序用于解决两个问题,只有 二维模拟器可以回答:同时存在的问题 最小化短通道效应,源电阻和边缘 自对准MESFET技术中的电容,并分析寄生效应 凹槽蚀刻技术中的电容。泊松方程解 电子浓度 n x y ) (假设服从玻尔兹曼统计)在浅层供体的情况下 以及受主,深供体(EL2)和受主(Cr)。二维压电 包括表面电位效应。结果,分析 计算是由薄层电阻和饱和电流在 每个垂直切片。总电容通过积分计算 模拟区域内的电子浓度,取两倍 (半FET)随栅极电压变化

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