Wafer level encapsulation for system in package generation

摘要

Within this paper, encapsulation technologies as transfer molding and printing have been investigated; focusing on the feasibility of reliable wafer encapsulation and the suitability of current materials. For these processes the potential of 3D structuring during the encapsulation has been evaluated. An electroless metallization process and laser techniques for structuring the metallization layer have been investigated for reliable interconnections. Summarized this paper presents the process development and feasibility of wafer level encapsulation technologies for SiP solutions.