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Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on

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1.A directional coupler incorporating a transverse Bragg grating in the GaAs/AlGaAs MQW heterostructure

机译：在GaAs / AlGaAs MQW异质结构中结合横向布拉格光栅的定向耦合器
- 作者：Wielichowski M.;Patela S.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
2.Web based packaging education - a systematic approach

机译：基于Web的包装教育-系统方法
- 作者：Draessler M.;Jirsa J.;Molhanec M.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
3.Scientific method as object of research in radioelectronic technology development

机译：科学方法成为无线电电子技术发展的研究对象
- 作者：Stefanova I.;Andonov A.;Petrov I.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
4.DNA chip with electronically accelerated processes

机译：具有电子加速过程的DNA芯片
- 作者：Gyorffy A.;Santha H.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
5.Review on electrodepositable photoresists and their possible ways to use them with laser direct imaging

机译：回顾可电沉积的光刻胶及其在激光直接成像中的使用方式
- 作者：Bihari G.;Illyefalvi-Vitez Z.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
6.Ecological technologies for soldering without lead in electronic and telecommunications - today and tomorrow

机译：电子和电信中无铅焊接的生态技术-今天和明天
- 作者：Mihaescu R.;Carstea H.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
7.Monitoring of large-area solar cell homogeneity by local irradiation

机译：通过局部照射监测大面积太阳能电池的均质性
- 作者：Benda V.;Asresahegn A.L.;Radil J.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
8.Thermal aspects of soldering equipments

机译：焊接设备的热学方面
- 作者：Ionescu R.;Simion-Zanescu D.;Reyes-Turcu P.;Svasta P.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
9.Remote course and degree delivery in China

机译：中国的远程课程和学位课程
- 作者：Morris J.E.;Fu Li;Xiangfu Zong
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
10.Integration of 980 nm AlGaAs/InGaAs laser diode and semiconductor optical amplifier

机译：集成980 nm AlGaAs / InGaAs激光二极管和半导体光放大器
- 作者：Wilk R.;Goralik G.;Sciana B.;Tlaczala M.;Patela S.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
11.Response of SnO₂ and ZnO adsorptive gas sensors on polluting gases

机译：SnO _{2 和ZnO吸附气体传感器对污染气体的响应}
- 作者：Fedak V.;Szasz C.;Ducso C.;Barsony I.;Kokenyesi S.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
12.Metal diffusion and surface pattern formation on GaAs and As₂S₃ semiconductors

机译：GaAs和As _{2 S _{3 半导体上的金属扩散和表面图案形成}}
- 作者：Ivan I.;Szabo I.;Mojzes I.;Kokenyesi S.;Nemcsics A.;Suszter M.;Misak S.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
13.Low temperature micro-calorimeters based on thick film resistors

机译：基于厚膜电阻的低温微热量计
- 作者：Mach M.;Pietrikova A.;Gabani S.;Pavlik V.;Flachbart K.;Orendacova A.;Orendac M.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
14.Low temperature properties of RuO₂-based resistors prepared under various technology conditions

机译：不同技术条件下制备的RuO _{2 基电阻的低温性能}
- 作者：Kardos S.;Somora M.;Gabani S.;Pavlik V.;Flachbart K.;Trpcevska J.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
15.Microelectronics packaging education related projects at BUTE-ETT

机译：BUTE-ETT的微电子封装教育相关项目
- 作者：Illyefalvi-Vitez Z.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
16.Wafer level encapsulation for system in package generation

机译：晶圆级封装，用于封装生成中的系统
- 作者：Braun T.;Becker K.-F.;Koch M.;Bader V.;Manessis D.;Neumann A.;Ostmann A.;Aschenbrenner R.;Reichl H.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
17.A technology enabling improved properties of polymer conductive pastes

机译：改善聚合物导电胶性能的技术
- 作者：Luniak M.;Roellig M.;Wolter K.J.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
18.Integrating sensor devices in a LIN bus network

机译：将传感器设备集成到LIN总线网络中
- 作者：Gabriel C.;Horia H.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
19.Application of computer tomography in electronic technology

机译：计算机断层扫描技术在电子技术中的应用
- 作者：Danczak M.;Wolter K.J.;Rieske R.;Roth H.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
20.Special features in electronic circuits modeling for fail-safe use

机译：用于故障安全使用的电子电路建模的特殊功能
- 作者：Stoytcheva N.;Georgieva M.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
21.Contributions on low-cost μBGA soldering/re-soldering methods

机译：低成本μBGA焊接/再焊接方法的贡献
- 作者：Grama A.;Chindris G.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
22.DSP's based energy meter

机译：基于DSP的电表
- 作者：Ovidiu P.;Gabriel C.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
23.The process analyses of technological production with ISO standard STEP/EXPRESS-P

机译：使用ISO标准STEP / EXPRESS-P进行技术生产的过程分析
- 作者：Molhanec M.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
24.Future integrated learning environments with multimedia

机译：未来的集成多媒体学习环境
- 作者：Teofilova V.;Saliev A.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
25.Tantalum and niobium technology overview

机译：钽铌技术概述
- 作者：Zednicek T.;Zednicek S.;Sita Z.;McCracken C.;Millman W.A.;Gill J.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
26.Matrix microsensor information scanning

机译：矩阵微传感器信息扫描
- 作者：Todorova V.;Mladenov M.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
27.Some aspects of lead free soldering

机译：无铅焊接的某些方面
- 作者：Stary J.;Szendiuch I.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
28.Electroless Ni/Au plating as a solderable finish on top of sequential buildup layers: overplating reliability considerations for the solder mask

机译：在连续堆积层的顶部进行化学镀镍/金作为可焊接表面处理：阻焊层的过镀可靠性考虑
- 作者：Siau S.;Degrendele L.;de Baets J.;van Calster A.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
29.Lead-free soldering effect to tantalum capacitors

机译：钽电容器的无铅焊接效果
- 作者：Zednicek T.;Vasina P.;Sita Z.;Vrana B.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
30.Parameters of UV laser microvia formation based on Taguchi method of experiment design

机译：基于田口实验设计方法的紫外激光微孔形成参数
- 作者：Borecki J.;Hackiewicz H.;Koziol G.;Sitek J.;Codreanu N.D.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
31.Computer modeling and research of an electronic track receiver reliability

机译：电子轨道接收器可靠性的计算机建模和研究
- 作者：Georgieva M.;Nenov I.;Dimitrova E.;Stoytcheva N.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
32.Promoting IT in Electronic Packaging education at Technical University of Cluj-Napoca

机译：在克卢日-纳波卡技术大学促进电子包装教育中的信息技术
- 作者：Pitica D.;Lungu S.;Radu M.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
33.New hydrodynamic arrangement for the thick film sensors measurements

机译：用于厚膜传感器测量的新型流体动力装置
- 作者：Prasek J.;Adamek M.;Krejci J.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
34.Novel thin film cuff electrode for neural stimulation

机译：用于神经刺激的新型薄膜袖带电极
- 作者：Malachowski K.;Albert M.;Bartha J.-W.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
35.Resonators embedded in LTCC

机译：嵌入LTCC的谐振器
- 作者：Prochazka T.;Szendiuch I.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
36.Quality and reliability assurance by implementation of lead-free technology in electronic industry

机译：通过在电子行业中实施无铅技术来保证质量和可靠性
- 作者：Zdzislaw D.;Marcin S.;Jaroslaw B.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
37.Thermal analysis of integrated polymer waveguides

机译：集成聚合物波导的热分析
- 作者：Stanowski R.;Rieske R.;Patela S.;Wolter K.-J.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
38.A new ELIN lossy integrator with instantaneous 'arcsinh' companding

机译：具有瞬时“ arcsinh”压扩的新型ELIN有损积分器
- 作者：Bozomitu R.G.;Goras L.;Cehan V.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
39.Application of PERT for microelectronics technology education

机译：PERT在微电子技术教育中的应用
- 作者：Szendiuch I.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
40.Normalized chart diagrams and their use in practical applications

机译：标准化图表及其在实际应用中的使用
- 作者：Guaqueta J.;Mach P.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
41.Partial discharge current measurement in high permittivity dielectrics and their meaning for quality control

机译：高介电常数电介质中局部放电电流的测量及其对质量控制的意义
- 作者：Mundlein M.;Hauser H.;Nicolics J.;Chabicovsky R.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
42.Ultra-high density packaging by component integration

机译：通过组件集成实现超高密度包装
- 作者：Ostmann A.;Neumann A.;Reichl H.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
43.Surface treatment of PA6 and ABS with oxygen plasma for molded interconnect devices

机译：PA6和ABS的氧等离子体表面处理，用于模制互连设备
- 作者：Paproth A.;Wolter K.-J.;Deltschew R.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
44.Thermal management system for reflow oven

机译：回流焊炉热管理系统
- 作者：Rosu B.;Reyes-Turcu P.;Simion-Zanescu D.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
45.Cost effective method for spatially resolved characterisation of board level optical waveguides

机译：板级光波导的空间分辨特性的经济有效方法
- 作者：Rieske R.;Nieweglowski K.;Wolter K.-J.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
46.Highly sensitive ammonia sensor

机译：高灵敏度氨传感器
- 作者：Ballun G.;Hajdu F.;Harsanyi G.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
47.Nonlinearity of thick film resistors in comparison with Zigalski theory

机译：与Zigalski理论相比，厚膜电阻器的非线性
- 作者：Pelikanova I.B.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
48.LTCC liquid conductivity detector

机译：LTCC液体电导率检测仪
- 作者：Wasilek P.;Golonka L.J.;Gorecka-Drzazga A.;Roguszczak H.;Zawada T.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
49.Testing of graphite paste properties for thick film sensors

机译：厚膜传感器的石墨糊特性测试
- 作者：Adamek M.;Prasek J.;Krejci J.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
50.A qualitative approach to the non-sinusoidal skin and proximity effect in high frequency interconnections

机译：定性方法解决高频互连中的非正弦皮肤和邻近效应
- 作者：Ene D.V.;Svasta P.;Vasiliu M.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
51.Packaging of a thin-film sensor for transepidermal water loss measurements

机译：用于表皮水分流失测量的薄膜传感器的包装
- 作者：Mundlein M.;Nicolics J.;Chabicovsky R.;Svasek P.;Svasek E.;Komeda T.;Funakubo H.;Nagashima T.;Ito M.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
52.Implementation of a genetic algorithm for components optimal placement in electronic packaging

机译：遗传算法用于电子包装中组件最佳放置的实现
- 作者：Svasta P.;Carstea H.;Rangu M.;Avram A.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
53.Results of a high density flip chip on flex reliability test program

机译：高密度倒装芯片在柔性可靠性测试程序上的结果
- 作者：Vandecasteele B.;Vanfleteren J.;Maattanen J.;Laitinen T.;de Maquille Y.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
54.Simulation of a capacitive pressure sensor with VHDL-AMS

机译：用VHDL-AMS模拟电容式压力传感器
- 作者：Gay N.A.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
55.Electronic transport in LTCC highly conductive RuO₂+ glass sinters

机译：LTCC高导电性RuO _{2 +玻璃烧结体中的电子传输}
- 作者：Kolek A.;Zawislak Z.;Stadler A.W.;Mleczko K.;Zak D.;Szalanski P.;Dziedzic A.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
56.Magnetoresistance of RuO₂-glass films

机译：RuO _{2 -玻璃薄膜的磁阻}
- 作者：Stadler A.W.;Kolek A.;Mleczko K.;Zak D.;Zawislak Z.;Szatanski P.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
57.Sensors selection for gas mixtures analysis systems

机译：气体混合物分析系统的传感器选择
- 作者：Szecowka P.M.;Szczurek A.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
58.Measurement uncertainty of piezoresistive beam-type humidity sensors

机译：压阻梁式湿度传感器的测量不确定度
- 作者：Hoa P.L.P.;Suchaneck G.;Gerlach G.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
59.Absolute pressure sensors in CERMET thick film technology

机译：CERMET厚膜技术中的绝对压力传感器
- 作者：Janovsky L.;Bauer R.;Ensminger D.;Bojarsky A.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
60.Preparing stents with masking and etching technology

机译：使用掩膜和蚀刻技术准备支架
- 作者：Nyitrai Z.;Illyefalvi-Vitez Z.;Pinkola J.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
61.Multimedia support in teaching of some electronics based courses

机译：多媒体支持某些电子课程的教学
- 作者：Kalita W.;Potencki J.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
62.Integration of thick film resistors in a multilayer structure

机译：在多层结构中集成厚膜电阻器
- 作者：Podprocky T.;Vandecasteele B.;de Baets J.;van Calster A.;Bansky J.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
63.Optimizing bipolar transistor performance in RF integrated circuits

机译：优化RF集成电路中的双极晶体管性能
- 作者：Katona J.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
64.3×3 heat-flux sensor array for the thermal measurement of IC packages

机译：3×3热流传感器阵列，用于IC封装的热测量
- 作者：Kollar E.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
65.Semiconductor gas sensors measuring system accuracy improvement with thermostimulated electrical conductance approach

机译：半导体气体传感器通过热刺激的电导方法测量系统的精度
- 作者：Sobanski T.;Licznerski B.;Szczurek A.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
66.Reliability of photonic systems - an introduction

机译：光子系统的可靠性-简介
- 作者：Patela S.;Rieske R.;Schmieder K.;Stanowski R.;Szecowka P.;Wabinski P.;Wolter K.-J.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
67.Measurement and analysis of packages with differential signaling scheme

机译：使用差分信令方案对包裹进行测量和分析
- 作者：Penkar A.;Caggiano M.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
68.The evaluation of accelerated reliability tests in microelectronics

机译：微电子学中加速可靠性测试的评估
- 作者：Urbancik J.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
69.New Ge-Me and Si-Me thin film compositions for high-temperature thermal converter construction

机译：用于高温热转换器结构的新型Ge-Me和Si-Me薄膜组合物
- 作者：Beensh-Marchwicka G.;Prociow E.;Osadnik S.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
70.Transient modelling of temperature field in planar and 3D microvolume LTCC and thick-film resistors

机译：平面和3D微型LTCC和厚膜电阻器中温度场的瞬态建模
- 作者：Zawada T.;Dziedzic A.;Golonka L.J.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
71.Influence of the conductive adhesives joints to decoupling impedance

机译：导电胶接头对去耦阻抗的影响
- 作者：Ionescu C.;Golumbeanu V.;Davidescu M.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
72.Degradation of adhesive bonds with short current pulses

机译：短电流脉冲会使胶粘剂降解
- 作者：Mach P.;Jes J.;Papez V.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
73.Properties of adhesive bonds exposed to the static and dynamic mechanical load

机译：承受静态和动态机械载荷的粘合性能
- 作者：Mach P.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
74.Lead-free solders and isotropically conductive adhesives in assembling of silicon solar cells - preliminary results

机译：硅太阳能电池组装中的无铅焊料和各向同性导电粘合剂-初步结果
- 作者：Dziedzic A.;Graczyk I.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
75.Strength sensor for dynamic wheel load measuring of railway carriages

机译：强度传感器，用于铁路机车的动态车轮载荷测量
- 作者：Nenov N.;Rouzhekov T.;Mihov G.;Dimitrov E.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
76.Films of intrinsically conducting polymers for applications in sensors

机译：用于传感器的本征导电聚合物薄膜
- 作者：Xuan Dung Dang;Schneider M.;Intelmann C.M.;Rammelt U.;Plieth W.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
77.Unique fiducial designs for CSP singulation process

机译：CSP分割过程的独特基准设计
- 作者：Vijchulata P.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
78.Influence of combined metal Ni + Au resist on properties of connection between devices and PCB

机译：Ni + Au组合金属抗蚀剂对器件与PCB连接性能的影响。
- 作者：Steiner F.;Hamacek A.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
79.Quality determination of microwelding connections of integral schemes

机译：整体方案微焊接连接的质量确定
- 作者：Tsyganok B.;Friedel J.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
80.Laser processing of solder resist layers on laminated substrates

机译：层压基板上阻焊层的激光加工
- 作者：Berenyi R.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
81.Failure research on an optoelectronic fail-safe logical circuit

机译：光电故障安全逻辑电路的故障研究
- 作者：Christov K.;Mitev K.;Stoytcheva N.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
82.Modelling of acceleration sensitivity of single-element pyroelectric infrared detectors

机译：单元素热释电红外探测器加速度灵敏度建模
- 作者：Chvedov D.;Norkus V.;Gerlach G.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
83.Applications of stress derating and thermal analysis to improve the reliability of electronic modules

机译：应力降额和热分析在提高电子模块可靠性中的应用
- 作者：Radu M.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
84.Composed material studies with microwave simulation methods

机译：用微波模拟方法进行材料研究
- 作者：Ionescu D.;Cehan V.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
85.Low-tech studies of isotropic electrically conductive adhesives

机译：各向同性导电胶的低技术研究
- 作者：Morris J.E.;Anderssohn F.;Loos E.;Liu A.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
86.Simulate surface acoustic wave devices using VHDL-AMS

机译：使用VHDL-AMS模拟表面声波设备
- 作者：Qiuyun Fu;Fischer W.J.;Stab H.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
87.Low-frequency electronic transformers with high stability parameters

机译：具有高稳定性参数的低频电子变压器
- 作者：Nenov I.;Georgieva M.;Dimitrova E.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
88.The behaviour of gas sensitive materials in the atmosphere with oxygen shortage

机译：缺氧大气中气体敏感材料的行为
- 作者：Teterycz H.;Licznerski B.W.;Klimkiewicz R.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
89.Possibilities to modify active centres on gas sensitive materials

机译：修改气体敏感材料活性中心的可能性
- 作者：Teterycz H.;Licznerski B.W.;Klimkiewicz R.;Laniecki M.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
90.AC response measurements of semiconductor gas sensors for temperature shift stimulation

机译：半导体气体传感器的温度变化刺激的交流响应测量
- 作者：Nitsch K.;Sobanski T.;Wisniewski K.;Licznerski B.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
91.Thick film initiator elements - an alternative to resistive wire initiators for automotive safety units

机译：厚膜引发剂元件-用于汽车安全装置的电阻丝引发剂的替代方法
- 作者：Smetana W.;Reicher R.;Mundlein M.;Nicolics J.;Homolka H.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
92.Ferroelectric thick films on LTCC substrates - preliminary results

机译：LTCC基板上的铁电厚膜-初步结果
- 作者：Hrovat M.;Holc J.;Drnovsek S.;Belavic D.;Bernard J.;Kosec M.;Golonka L.;Dziedzic A.;Kita J.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
93.Influence of the Cu substrate surface energy on lead-free solder paste wetting properties

机译：铜基板表面能对无铅焊锡膏润湿性能的影响
- 作者：Sitek J.;Bukat K.;Borecki J.;Ionescu C.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
94.Experimental signal shapes for coupled transmission lines

机译：耦合传输线的实验信号形状
- 作者：Cehan V.;Ionescu D.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
95.1/f noise versus magnetic field in RuO₂ based thick film resistors

机译：基于RuO _{2 的厚膜电阻器的1 / f噪声与磁场的关系}
- 作者：Ptak P.;Kolek A.;Zawislak Z.;Mleczko K.;Stadler A.W.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
96.Process and machine capabilities of soldering processes

机译：焊接过程的过程和机器功能
- 作者：Heinz W.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
97.Emission spectra control for infrared heaters by electronic pulse management

机译：通过电子脉冲管理控制红外加热器的发射光谱
- 作者：Mashkov P.;Pencheva T.;Popov D.;Mateev V.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
98.Thermal shock reliability tests of multilayer LTCC modules with thick film conductors

机译：具有厚膜导体的多层LTCC模块的热冲击可靠性测试
- 作者：Pietrikova A.;Bansky J.;Bujalobokova M.;Urbancik J.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
99.Authors Index of ISSE 2003

机译：ISSE 2003作者索引
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》
100.Rapid inductance calculation for interconnects containing current returning, grounded, floating conductors

机译：包含返回电流，接地，浮动导体的互连的快速电感计算
- 作者：Ou J.;Caggiano M.F.
- 会议名称：《Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on》