Inner lead bonding techniques for 500 lead dies having a 90 μmlead pitch

摘要

A study of tape automated bonding (TAB) undertaken in order toinvestigate the application of 500-lead bonding in mass production isdiscussed. The Toshiba TT1-700, the automatic inner lead bonder used,has a maximum applied pressure of 30 kgf, an alignment accuracy of 10μm, and an index time of 3.9 s, including a 1-s bonding time. Themachine's alignment and bonding accuracy, the determination ofacceptable bonding conditions, the effects of tool planarity anparallelism on bond strength and bump deformation, and the effects ofbonding conditions on the rate of bond strength degradation duringcontinuous bonding, using 12.7-mm2 and 504-lead test dieswith a lead pitch of 90 μm, are discussed. Employment of the TTI-700resulted in highly accurate inner lead bonding for finely pitched leadswith high lead counts