Bonding manner null of narrow pitch lead/read

摘要

PURPOSE: To provide a bonding method capable of reducing a pressing force for pressing a pressed surface, easily maintaining the flatness of the pressing side of a presser tool, and ensuring the high durability of the tool. ;CONSTITUTION: The lower side of leads L of a small pitch lead device is superposed on the upper side of the panel electrode 2 of a panel element D. Then, a filament body 6 having a hardenable resin coating surface 6c on the lower side is pressed to the upper side of the leads L, and the surface 6c is press fitted to the upper side of the leads L, thereby filling a gap (k) between adjacent leads L and L with hardenable resin 3. Thereafter, with the lower side of the leads L kept in contact with the upper side of the electrode 2 under pressure, the resin 3 is hardened and, then, a pressing force for the filament body 6 is released.;COPYRIGHT: (C)1993,JPO&Japio