Development of Fine Pitch Inner Lead Bonding TCP for LCD Driver IC

摘要

The Tape Carrier Package (TCP) is the most popular package to apply for LCD driver ICs. According to market needs, LCD must be lower cost and higher resolution. For this reason, a driver IC becomes smaller die size, and more minimal pad pitches. Therefore, we had to develop a technology for finer pitch Inner Lead Bonding (ILB) on TCP. Now we developed mass production technology of fine pitch ILB TCP (60 μm pitch ILB). In this paper, we mention about the outline of this technology.