Asimple test method forelectromigration reliability ofsolder/Cu pillar bumpsusing flat cables

摘要

To evaluate electromigration (EM) reliability of solder/copper (Cu) pillar bumps, a simple and low-cost test method using a flat cable has been developed. The EM lifetime of the pillar bumps with differently plated structures or different plating chemicals were compared. The results show the different lifetime distributions depending on the different structures or plating chemicals. From the results, the developed test method is considered to be effective for evaluating the EM reliability in a process development such as optimization of plating chemicals.