Ag-coated Cu pillar bonding structure and bonding method using the Ag-coated Cu pillars

摘要

The present invention relates to a bonding structure using a silver coated copper filament and a bonding method using the same. In order to achieve the above object, the present invention provides a bonding structure using a silver coated copper filament comprising a copper filament having irregularities on its surface and a silver coating layer formed on the copper filament Wherein the silver coating layer is formed so as to be in situ transferred in the form of a nodule in the process of heating the silver coating layer to a specific temperature or higher, thereby joining the members to be bonded. And a joining method using the joining structure. As a result, it is possible to finely realize the silver-coated copper filament structure and it can be applied to ultrafine pitch bonding without forming a molten part in the bonding process, and bonding can be performed even at a low bonding pressure, A structure can be formed, and a junction structure excellent in electrical conductivity and thermal conductivity can be provided while having excellent high-temperature reliability.