基于先进封装的铜柱凸块技术

摘要

铜柱凸块技术用于实现集成电路封装的芯片基板互联,具有优越的电性能、热性能和可靠性,并可满足RoHS要求.随着电子产品对小型化和轻量化的要求越来越高,铜柱凸块将逐渐取代锡铅凸块技术,实现更高密度的芯片互连,成为先进封装的主流技术.%Copper pillar bumping technology provides the electrical contact of substrate and chips,improve reliability and enhance electrical and thermal connection characteristics,and meet the demands of RoHS.With the higher dependence on minimization and lightweight of the electrical products,copper pillar bumping can achieve higher interconnect densities,and successively replace solder ball bumping,and will become mainstream technology in advanced electric-packages.