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IEEE Electron Devices Technology and Manufacturing Conference

召开年：2017
召开地：Toyama(JP)
出版时间：-

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1.Comparative study on RTN amplitude in planar and FinFET devices

机译：平面和FinFET器件中RTN幅度的比较研究
- 作者：Zexuan Zhang;Zhe Zhang;Shaofeng Guo;Runsheng Wang;Xingsheng Wang;Binjie Cheng;Asen Asenov;Ru Huang
- 会议名称：《IEEE Electron Devices Technology and Manufacturing Conference》 | 2017年
- FinFETs;
- Charge carrier density;
- Solid modeling;
- Two dimensional displays;
- Potential well;
- Three-dimensional displays;
- Current density;
2.Defect formation in SiO2 formed by thermal oxidation of SiC

机译：SiC热氧化形成的SiO2中的缺陷形成
- 作者：Kenta Chokawa;Masaaki Araidai;Kenji Shiraishi
- 会议名称：《IEEE Electron Devices Technology and Manufacturing Conference》 | 2017年
- Silicon carbide;
- Oxidation;
- MOSFET;
- Silicon;
- Threshold voltage;
- Temperature;
3.Oxidation mechanism and surface passivation of Germanium by ozone

机译：臭氧对锗的氧化机理和表面钝化
- 作者：Xiaolei Wang;Jinjuan Xiang;Chao Zhao;Tianchun Ye;Wenwu Wang
- 会议名称：《IEEE Electron Devices Technology and Manufacturing Conference》 | 2017年
- Oxidation;
- Gases;
- Passivation;
- Atomic layer deposition;
- Three-dimensional displays;
- Microelectronics;
4.Ohmic contact formation between Ge2Sb2Te5 phase change material and vertically aligned carbon nanotubes

机译：Ge2Sb2Te5相变材料和垂直排列的碳纳米管之间的欧姆接触形成
- 作者：Panni Wang;Suwen Li;Yihan Chen;Lining Zhang;Mansun Chan
- 会议名称：《IEEE Electron Devices Technology and Manufacturing Conference》 | 2017年
- Electrodes;
- Silicides;
- Ohmic contacts;
- Carbon nanotubes;
- Surface treatment;
- Phase change materials;
- Filling;
5.The impact of oxygen insertion technology on SRAM yield performance

机译：氧气插入技术对SRAM成品率的影响
- 作者：A. Marshall;S. Nimmalapudi;W. K. Loh;J. Krick;L. Hutter;H. Takeuchi;R. Stephenson;R. J. Mears;S. Ikeda
- 会议名称：《IEEE Electron Devices Technology and Manufacturing Conference》 | 2017年
6.Punch-through stop doping profile control via interstitial trapping by oxygen-insertion silicon channel

机译：通过氧插入硅通道的间隙俘获实现穿通停止掺杂轮廓控制
- 作者：Robert J. Mears;Hideki Takeuchi;Robert J. Stephenson;Marek Hytha;Richard Burton;Nyles W. Cody;Doran Weeks;Dmitri Choutov;Nidhi Agrawal;Suman Datta
- 会议名称：《IEEE Electron Devices Technology and Manufacturing Conference》 | 2017年
- Silicon;
- Boron;
- FinFETs;
- Logic gates;
- Annealing;
- Phosphorus;
- Oxidation;
7.Local, isotropic, and damageless doping to oxide semiconductors by using electrochemistry

机译：通过电化学对氧化物半导体进行局部，各向同性和无损掺杂
- 作者：Takeaki Yajima;Tomonori Nishimura;Akira Toriumi
- 会议名称：《IEEE Electron Devices Technology and Manufacturing Conference》 | 2017年
- Doping;
- Films;
- Electrodes;
- Resistance;
- Electric potential;
- Conductivity;
8.Degradation caused by Negative Bias temperature instability depending on Body Bias on NMOS or PMOS in 65 nm bulk and thin-BOX FDSOI processes

机译：负偏置温度不稳定性所导致的性能下降取决于65 nm体和薄盒FDSOI工艺中NMOS或PMOS上的体偏置
- 作者：Ryo Kishida;Kazutoshi Kobayashi
- 会议名称：《IEEE Electron Devices Technology and Manufacturing Conference》 | 2017年
- Degradation;
- Silicon-on-insulator;
- Negative bias temperature instability;
- Thermal variables control;
- Logic gates;
- Aging;
9.Growing market of MEMS and technology development in process and tools specialized to MEMS

机译：不断增长的MEMS市场以及专用于MEMS的工艺和工具的技术开发
- 作者：Hiroshi Yanazawa;Kohji Homma
- 会议名称：《IEEE Electron Devices Technology and Manufacturing Conference》 | 2017年
- Micromechanical devices;
- Etching;
- Silicon;
- Plasmas;
- Hafnium;
- Wiring;
10.Micro structuring polydimethylsiloxane elastomer film with 3D printed mold for low cost and high sensitivity flexible capacitive pressure sensor

机译：具有3D打印模具的微结构化聚二甲基硅氧烷弹性体薄膜，用于低成本和高灵敏度的柔性电容式压力传感器
- 作者：Bengang Zhuo;Sujie Chen;Xiaojun Guo
- 会议名称：《IEEE Electron Devices Technology and Manufacturing Conference》 | 2017年
- Sensitivity;
- Pressure sensors;
- Three-dimensional displays;
- Reliability;
- Real-time systems;
- Monitoring;
- Wrist;
11.Crystallinity improvement using migration-enhancement methods for sputtered-MoS2 films

机译：使用迁移增强方法改善溅射MoS2薄膜的结晶度
- 作者：Shin Hirano;Junichi Shimizu;Kentaro Matsuura;Takumi Ohashi;Iriya Muneta;Kuniyuki Kakushima;Kazuo Tsutsui;Hitoshi Wakabayashi
- 会议名称：《IEEE Electron Devices Technology and Manufacturing Conference》 | 2017年
- Molybdenum;
- Sulfur;
- Films;
- Substrates;
- Radio frequency;
- Sputtering;
- Raman scattering;
12.Photoresist development for wafer-level packaging process

机译：用于晶圆级封装工艺的光刻胶开发
- 作者：Makiko Irie;Toshiaki Tachi;Atushi Sawano
- 会议名称：《IEEE Electron Devices Technology and Manufacturing Conference》 | 2017年
- Resists;
- Wafer scale integration;
- Topology;
- Sensitivity;
- Substrates;
- Lithography;
13.Electroluminescence characteristics of rare earth doped silicon based light emitting device

机译：稀土掺杂硅基发光器件的电致发光特性
- 作者：Fumihiro Hattori;Hideyuki Iwata;Toshihiro Matsuda;Takashi Ohzone
- 会议名称：《IEEE Electron Devices Technology and Manufacturing Conference》 | 2017年
- Silicon;
- Ions;
- MOS devices;
- Substrates;
- Current measurement;
- Liquids;
- Indium tin oxide;