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Hot Carrier Stress modeling: From degradation kinetics to trap distribution evolution

机译:热载流子应力模型:从降解动力学到陷阱分布演变

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摘要

A complete TCAD model addressing Hot Carrier Degradation for Flash technology is presented. After having underlined the need for a power law with a low exponent for the aging kinetics and considered a high activation energy reflecting the single electron impact mode, a fine calibration is achieved. Finally, analysis on trap distribution and aging rates at different channel locations are provided.
机译:提出了一个完整的TCAD模型,该模型解决了Flash技术的热载流子退化问题。在强调了对老化动力学具有低指数的幂律并考虑到反映单电子撞击模式的高活化能之后,可以实现精细的校准。最后,提供了在不同通道位置的陷阱分布和老化率的分析。

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