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Hot Carrier Stress modeling: From degradation kinetics to trap distribution evolution

机译:热载体应力建模:从降解动力学到陷阱分布演化

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摘要

A complete TCAD model addressing Hot Carrier Degradation for Flash technology is presented. After having underlined the need for a power law with a low exponent for the aging kinetics and considered a high activation energy reflecting the single electron impact mode, a fine calibration is achieved. Finally, analysis on trap distribution and aging rates at different channel locations are provided.
机译:提出了一种完整的TCAD模型,用于解决Flash技术的热载波降低。在下划线下划线后,对老化动力学的低指数的功率法,并且考虑了反射单电子冲击模式的高激活能量,实现了精细校准。最后,提供了对不同通道位置处的陷阱分布和老化速率分析。

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