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Gate oxide defectiveness levels: an experimental comparison between Planar and Trench Low Voltage Power MOSFET technologies

机译:栅极氧化物缺陷等级:平面和沟槽低压功率MOSFET技术之间的实验比较

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Gate oxide reliability of Power MOSFETs strongly depends on their defectiveness levels. Higher defectiveness levels could involve in higher gate leakage current, threshold voltage shift effects and lower oxide reliability. Therefore, it is important to evaluate gate oxide defectiveness. This paper estimates the different oxide defectiveness levels of two main topologies utilized in Low Voltage Power MOSFETs and it shows how the Trench compared to the Planar oxide shows higher defectiveness levels especially considering interface traps.
机译:功率MOSFET的栅极氧化层可靠性在很大程度上取决于其缺陷等级。较高的缺陷水平可能涉及较高的栅极泄漏电流,阈值电压漂移效应和较低的氧化物可靠性。因此,评估栅极氧化物缺陷很重要。本文估算了低压功率MOSFET中使用的两种主要拓扑结构的不同氧化物缺陷等级,并显示了与平面氧化物相比,Trench的缺陷等级更高,尤其是考虑到界面陷阱的情况。

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