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Low ON-resistance SiC Trench/Planar MOSFET with reduced OFF-state oxide field and low gate charges

机译:低导通电阻的SiC沟槽/平面MOSFET,具有减少的截止态氧化物场和低栅极电荷

摘要

We propose a SiC trench/planar MOSFET (TP-MOS) which features a trench channel and a planar channel in one half-cell. Numerical simulations with Sentaurus TCAD have been carried out to study the proposed device architecture. Compared with traditional planar MOSFET (P-MOS), the TP-MOS has a much lower RON owing to the increased channel density. Unlike traditional trench MOSFET (T-MOS) which enables a higher channel density at the price of a high bottom-oxide field in the high-voltage OFF-state, the TP-MOS features bottom p-bases as in the P-MOS that protect the gate oxide from high electric field. The OFF-state oxide field in the TP-MOS is found to be even lower than the P-MOS. In addition, the TP-MOS boasts a low feedback capacitance (Crss) and gate-to-drain charge (QGD), since the coupling between the gate and the drain is suppressed by the collective effects of the top p-bases and the bottom p-bases. The QG of the TP-MOS is nearly the same as the P-MOS, and is much smaller than the T-MOS. Superior figures of merits (QG × RON and QGD × RON) are achieved in the TP-MOS.
机译:我们提出了一种SiC沟槽/平面MOSFET(TP-MOS),该沟槽在一个半单元中具有沟槽沟道和平面沟道。已经使用Sentaurus TCAD进行了数值模拟,以研究所提出的设备架构。与传统的平面MOSFET(P-MOS)相比,由于沟道密度的增加,TP-MOS的RON大大降低。与传统的沟槽MOSFET(T-MOS)可以在高电压OFF状态下以高底部氧化物场为代价实现更高的沟道密度相比,TP-MOS具有底部p基极,就像在P-MOS中那样保护栅氧化层免受高电场的影响。发现TP-MOS中的截止态氧化物场甚至低于P-MOS。此外,TP-MOS具有低反馈电容(Crss)和栅极至漏极电荷(QGD),因为栅极和漏极之间的耦合被顶部p基极和底部的集体效应所抑制p基。 TP-MOS的QG与P-MOS几乎相同,并且比T-MOS小得多。 TP-MOS具有优异的性能指标(QG×RON和QGD×RON)。

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