Coreless organic substrates have been desired for many years in order to provide the ultimate wiring capacity that can be achieved just like in ceramic substrates. To date, there have been few successful implementations mostly only for small body size substrates because of the choice of dielectric materials. Here, a technology has been developed based on prepreg dielectrics and on pattern plating to build sequentially the layers of a coreless substrate. A temporary carrier is employed to facilitate handling during the manufacturing process.
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