THERMOSETTING RESIN COMPOSITION FOR CORELESS SUBSTRATE, PREPREG FOR CORELESS SUBSTRATE, CORELESS SUBSTRATE, METHOD FOR MANUFACTURING CORELESS SUBSTRATE, AND SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide a thermosetting resin composition for coreless substrate which highly achieves low warpage and dimensional stability in a level required for the coreless substrate, and to provide a prepreg for coreless substrate, a coreless substrate, a method for manufacturing a coreless substrate and a semiconductor package using the same.;SOLUTION: There are provided a thermosetting resin composition for coreless substrate which contains a siloxane compound (a) having at least two primary amino groups in one molecule, and a maleimide compound (b) having at least two N-substituted maleimide groups in one molecule; and a prepreg for coreless substrate, a coreless substrate, a method for manufacturing a coreless substrate and a semiconductor package using the same.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2018,JPO&INPIT