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Reliability Studies of a Through Via Silicon Stacked Module for 3D Microsystem Packaging

机译：3D微系统封装的直通硅堆叠模块的可靠性研究

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《Electronic Components and Technology Conference, 2006. Proceedings. 56th》|2006年|P.1449-1453|共5页
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Seung Wook Yoon; Witarsa D.; Yak Long Lim S.; Vetrivel Ganesh; Viswanath A.G.K.; Tai Chong Chai; Navas K.O.; Vaidyanathan Kripesh;
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2. Reliability study of 3D IC packaging based on through-silicon interposer (TSI) and silicon-less interconnection technology (SLIT) using finite element analysis [J] . Che Fa Xing, Zhang Xiaowu, Lin Jong-Kai Microelectronics & Reliability . 2016,第JUNa期

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机译：通过硅堆叠模块的可靠性研究3D微系统包装
5. Structural Optimization & Reliability of 3D Package by Studying Crack Behavior on TSV & BEOL & Impact of Power Cycling on Reliability Flip Chip Package [D] . Rahangdale, Unique. 2017

机译：三维封装的结构优化及可靠性研究TSV＆BEOL裂缝行为及功率循环对可靠性倒装芯片封装的影响
6. A Study on Electrical Reliability Criterion on Through Silicon Via Packaging [O] . Ben-Je Lwo, Kuo-Hao Tseng, Kun-Fu Tseng -1

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7. 3D Stacking of Microwave Modules for High-Density Packaging [O] . Posada Quijano Guillermo 2008

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8. Silicon Wafer Advanced Packaging (SWAP). Multichip Module (MCM) Foundry Study.Version 2 [R] . Mowatt, L., Henry, F., Avery, M., 1991

机译：硅晶片高级封装（sWap）。多芯片模块（mCm）Foundry study.Version 2

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