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Silicon Wafer Advanced Packaging (SWAP). Multichip Module (MCM) Foundry Study.Version 2

机译：硅晶片高级封装（sWap）。多芯片模块（mCm）Foundry study.Version 2

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摘要

MCM technology is crucial to maintaining the competitive position of the U.S.

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作者
Mowatt, L.; Henry, F.; Avery, M.; Sadler, P.; Eskew, M.;
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年度 1991
页码
总页数 244
原文格式 PDF
正文语种 eng
中图分类工业技术;
关键词
Chips(Electronics); Costs; Electronics industry; Foundries; Low costs; Marketing; Modular construction; Overseas; Packaging; Risk; Silicon; Wafers;

机译：芯片（电子）;成本;电子工业;铸造厂;低成本;市场营销;模块化建筑;海外;包装;风险;硅;晶圆;

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专利

1. A wafer-scale packaging structure with monolithic microwave integrated circuits and passives embedded in a silicon substrate for multichip modules for radio frequency applications [J] . Fei Geng, Xiao-yun Ding, Gao-wei Xu, Journal of Micromechanics and Microengineering . 2009,第10期

机译：一种晶片级封装结构，具有单片微波集成电路和无源元件，其嵌入在硅基板中，用于射频应用的多芯片模块
2. Recent advances in plastic packaging of flip-chip and multichip modules (MCM) of microelectronics [J] . Wong C.P., Wong M.M. IEEE Transactions on Components and Packaging Technologies . 1999,第1期

机译：微电子倒装芯片和多芯片模块（MCM）塑料封装的最新进展
3. A silicon-on-silicon field programmable multichip module (FPMCM)integrating FPGA and MCM technologies [J] . Darnauer J., Isshiki T., Garay P., IEEE Transactions on Components, Packaging, and Manufacturing Technology. Part B, Advanced Packaging . 1995,第4期

机译：集成了FPGA和MCM技术的硅上硅现场可编程多芯片模块（FPMCM）
4. RECENT ADVANCES IN PLASTIC PACKAGING OF FLIP-CHIP MULTICHIP MODULES (MCM) OF MICROELECTRONICS [C] . C. P. Wong Electronic components and materials sensors and actuators . 1995

机译：微电子倒装多芯片模块（MCM）塑料封装的最新进展
5. The design, fabrication, and analysis of half-bridge multichip power modules (MCPMs) utilizing advanced laminate, silicon carbide, and diamond-like carbon technologies. [D] . Lostetter, Alexander Barrett. 2003

机译：利用先进的层压板，碳化硅和类金刚石碳技术对半桥多芯片电源模块（MCPM）进行设计，制造和分析。
6. Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems [O] . Kenji Okabe, Horagodage Prabhath Jeewan, Shota Yamagiwa, 2015

机译：用于无线供电的神经接口系统的薄膜柔性天线和硅CMOS整流器芯片的协同设计方法和晶圆级封装技术
7. Design specifications for manufacturability of MCM-C multichip modules [O] . Allen, C., Blazek, R., Desch, J., 1995

机译：mCm-C多芯片模块的可制造性设计规范

Silicon Wafer Advanced Packaging (SWAP). Multichip Module (MCM) Foundry Study.Version 2

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