adhesives; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; electrical contacts; contact resistance; flip-chip devices; electric resistance; nickel alloys; copper alloys; contact metallization; electrical resistance reliability; ACF interconnection; anisotropically conductive adhesives; anisotropically conductive films; ACA interconnection; flip chip assembly; interconnection reliability; flex substrate; bump/pad metallizations couple; contact resistance; reliability tests; humidity; temperature; thermal cycling; Ni-Cu coupled metallization;
机译:柔性倒装芯片应用中各向异性导电膜互连的接触电阻,可靠性和衰减机理研究
机译:回流工艺对柔性应用上倒装芯片各向异性导电膜互连的接触电阻和可靠性的影响
机译:在细间距玻璃上芯片应用中,通过粘度控制和高T_g ACF增强各向异性导电膜(ACF)互连的电稳定性
机译:接触金属化对芯片芯片互联电阻可靠性的影响
机译:无铅焊料涂层电触点的电气特性和可靠性评估。
机译:接触塞沉积条件对多级CMOS逻辑互连器件中结漏电流和接触电阻的影响
机译:磨削对涂层硬质合金的表面完整性,抗弯强度和抗接触破坏性的影响