掌桥科研
一站式科研服务平台
科技查新
收录引用
专题文献检索
外文数据库（机构版）
更多产品
首页
成为会员
我要充值
退出
我的积分：
中文会员
开通
中文文献批量获取
外文会员
开通
外文文献批量获取
我的订单
会员中心
我的包量
我的余额
登录/注册
文献导航
中文期刊
>
中文会议
>
中文学位
>
中国专利
>
外文期刊
>
外文会议
>
外文学位
>
外国专利
>
外文OA文献
>
外文科技报告
>
中文图书
>
外文图书
>
工业技术
基础科学
医药卫生
农业科学
教科文艺
经济财政
社会科学
哲学政法
其他
工业技术
基础科学
医药卫生
农业科学
教科文艺
经济财政
社会科学
哲学政法
其他
自然科学总论
数学、物理、化学、力学
天文学、地球科学
生物科技
医学、药学、卫生
航空航天、军事
农林牧渔
机械、仪表工业
化工、能源
冶金矿业
电子学、通信
计算机、自动化
土木、建筑、水利
交通运输
轻工业技术
材料科学
电工技术
一般工业技术
环境科学、安全科学
图书馆学、情报学
社会科学
其他
马克思主义、列宁主义、毛泽东思想、邓小平理论
哲学、宗教
社会科学总论
政治、法律
军事
经济
文化、科学、教育、体育
语言、文字
文学
艺术
历史、地理
自然科学总论
数理科学和化学
天文学、地球科学
生物科学
医药、卫生
农业科学
工业技术
交通运输
航空、航天
环境科学、安全科学
综合性图书
自然科学总论
数学、物理、化学、力学
天文学、地球科学
生物科技
医学、药学、卫生
航空航天、军事
农林牧渔
机械、仪表工业
化工、能源
冶金矿业
电子学、通信
计算机、自动化
土木、建筑、水利
交通运输
轻工业技术
材料科学
电工技术
一般工业技术
环境科学、安全科学
图书馆学、情报学
社会科学
其他
自然科学总论
数学、物理、化学、力学
天文学、地球科学
生物科技
医学、药学、卫生
航空航天、军事
农林牧渔
机械、仪表工业
化工、能源
冶金矿业
电子学、通信
计算机、自动化
土木、建筑、水利
交通运输
轻工业技术
电工技术
一般工业技术
环境科学、安全科学
图书馆学、情报学
社会科学
其他
自然科学总论
数学、物理、化学、力学
天文学、地球科学
生物科技
医学、药学、卫生
航空航天、军事
农林牧渔
机械、仪表工业
化工、能源
冶金矿业
电子学、通信
计算机、自动化
土木、建筑、水利
交通运输
轻工业技术
材料科学
电工技术
一般工业技术
环境科学、安全科学
图书馆学、情报学
社会科学
其他
美国国防部AD报告
美国能源部DE报告
美国航空航天局NASA报告
美国商务部PB报告
外军国防科技报告
美国国防部
美国参联会主席指示
美国海军
美国空军
美国陆军
美国海军陆战队
美国国防技术信息中心(DTIC)
美军标
美国航空航天局(NASA)
战略与国际研究中心
美国国土安全数字图书馆
美国科学研究出版社
兰德公司
美国政府问责局
香港科技大学图书馆
美国海军研究生院图书馆
OALIB数据库
在线学术档案数据库
数字空间系统
剑桥大学机构知识库
欧洲核子研究中心机构库
美国密西根大学论文库
美国政府出版局（GPO）
加利福尼亚大学数字图书馆
美国国家学术出版社
美国国防大学出版社
美国能源部文献库
美国国防高级研究计划局
美国陆军协会
美国陆军研究实验室
英国空军
美国国家科学基金会
美国战略与国际研究中心-导弹威胁网
美国科学与国际安全研究所
法国国际关系战略研究院
法国国际关系研究所
国际宇航联合会
美国防务日报
国会研究处
美国海运司令部
北约
盟军快速反应部队
北约浅水行动卓越中心
北约盟军地面部队司令部
北约通信信息局
北约稳定政策卓越中心
美国国会研究服务处
美国国防预算办公室
美国陆军技术手册
一般OA
科技期刊论文
科技会议论文
图书
科技报告
科技专著
标准
其它
美国卫生研究院文献
分子生物学
神经科学
药学
外科
临床神经病学
肿瘤学
细胞生物学
遗传学
公共卫生&环境&职业病
应用微生物学
全科医学
免疫学
动物学
精神病学
兽医学
心血管
放射&核医学&医学影像学
儿科
医学进展
微生物学
护理学
生物学
牙科&口腔外科
毒理学
生理学
医院管理
妇产科学
病理学
生化技术
胃肠&肝脏病学
运动科学
心理学
营养学
血液学
泌尿科学&肾病学
生物医学工程
感染病
生物物理学
矫形
外周血管病
药物化学
皮肤病学
康复学
眼科学
行为科学
呼吸学
进化生物学
老年医学
耳鼻喉科学
发育生物学
寄生虫学
病毒学
医学实验室检查技术
生殖生物学
风湿病学
麻醉学
危重病护理
生物材料
移植
医学情报
其他学科
人类生活必需品
作业；运输
化学；冶金
纺织；造纸
固定建筑物
机械工程；照明；加热；武器；爆破
物理
电学
人类生活必需品
作业；运输
化学；冶金
纺织；造纸
固定建筑物
机械工程；照明；加热；武器；爆破
物理
电学
马克思主义、列宁主义、毛泽东思想、邓小平理论
哲学、宗教
社会科学总论
政治、法律
军事
经济
文化、科学、教育、体育
语言、文字
文学
艺术
历史、地理
自然科学总论
数理科学和化学
天文学、地球科学
生物科学
医药、卫生
农业科学
工业技术
交通运输
航空、航天
环境科学、安全科学
综合性图书
主题
主题
题名
作者
关键词
摘要
高级搜索 >
外文期刊
外文会议
外文学位
外国专利
外文图书
外文OA文献
中文期刊
中文会议
中文学位
中国专利
中文图书
外文科技报告
清除
历史搜索
清空历史
首页
>
外文会议
>
其他
>
IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis
IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis
召开年：
召开地：
出版时间：
-
会议文集：
-
会议论文
热门论文
全部论文
全选（
0
）
清除
导出
1.
Buckle-driven delamination of thin film and the influence of the Casimir or van der Waals force interaction
机译：
扭转的分层薄膜和Casimir或Van der WaaS力相互作用的影响
作者：
Yu Shouwen
;
Li Qunyang
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
semiconductor thin films;
delamination;
van der Waals forces;
buckling;
finite element analysis;
buckle-driven delamination;
thin film delamination;
Casimir force interaction;
van der Waals force interaction;
indentation test;
thin film interfacial adhesion;
linear elastic fracture mechanics;
post-buckling theory;
post-buckling response;
FEM calculation;
double-buckling response;
strain energy release rate;
post-buckling behavior;
2.
Effect of curing condition of adhesion strength and ACA flip-chip contact resistance
机译：
粘合强度和ACA倒装芯片接触电阻固化条件的影响
作者：
Liqiang Cao
;
Zonghe Lai
;
Liu J.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
flip-chip devices;
adhesives;
contact resistance;
curing;
electrical conductivity;
scanning electron microscopy;
surface topography;
integrated circuit bonding;
curing condition;
adhesion strength;
ACA flip-chip;
contact resistance;
electrical conductivity;
interconnecting materials;
electronics manufacturing;
low processing temperature;
fine pitch capability;
conducting adhesive technology;
anisotropic conductive adhesive;
ACA interconnection;
electrical interconnections;
mechanical interconnections;
fine pitch applications;
flip chip assembly;
adhesive interface;
humidity aging;
interface adhesion;
optimum curing degree;
curing temperature;
differential scanning calorimeter;
isothermal condition;
temperature scanning;
peel test;
microstructural investigation;
fracture surfaces;
scanning electron microscopy;
electrical performance;
mechanical performance;
bonding temperature;
120 C;
3.
A study of threshold variation compensated inverter-comparator for pulse circuits
机译：
脉冲电路阈值变化补偿逆变器的研究
作者：
Cong Feng
;
Zhang Jinyi
;
Yan Limin
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
pulse circuits;
comparators (circuits);
invertors;
CMOS integrated circuits;
integrated circuit noise;
threshold variation;
inverter-comparator;
pulse circuits;
threshold compensation;
power supply noise;
power dissipation;
moving communications;
CSMC;
CMOS technical library;
555 timer;
monostable trigger;
0.6 micron;
4.
Packaging technology for imager using through-hole interconnections in Si substrate
机译：
用于成像仪的包装技术在Si衬底中使用通孔互连
作者：
Hirafune S.
;
Yamamoto S.
;
Wada H.
;
Okanishi K.
;
Tomita M.
;
Matsumaru K.
;
Suemasu T.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
image sensors;
chip scale packaging;
integrated circuit interconnections;
elemental semiconductors;
silicon;
packaging technology;
through-hole interconnections;
high-density IC packaging;
electric circuits;
fabrication technology;
wafer-level-packaging;
glass cap;
image sensing area;
copper rerouting;
solder bumps;
mechanical characteristics;
electrical characteristics;
imager;
5.
A low cost bumping method for flip chip assembly and MEMS integration
机译：
倒装芯片组件和MEMS集成的低成本凸块方法
作者：
Zhang J.H.
;
Wang C.H.
;
Pang A.J.
;
Zeng J.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
flip-chip devices;
wafer bonding;
metallisation;
micromechanical devices;
low cost bumping;
flip chip assembly;
MEMS integration;
chip-wafer bumping;
bump transfer approach;
high melting temperature bumps;
copper bumps;
nickel bumps;
gold bumps;
bump fabrication;
target board;
aluminum pads;
test chips;
remetallisation;
electroless nickel;
thermocompression bonding;
parallel bonding;
bump shear test;
Cu;
Ni;
Au;
Al;
6.
Heat transfer analyses of molten droplet solder bumping for electronic interconnection
机译：
电子互联熔融液滴焊料凸起的传热分析
作者：
Fuquan Lia
;
Chunqing Wang
;
Zhenqing Zhao
;
Liu P.
;
Deming Liu
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
solders;
integrated circuit interconnections;
integrated circuit packaging;
heat transfer;
surface morphology;
finite element analysis;
heat transfer analyses;
solder bumping;
electronic interconnection;
bumping method;
63Sn37Pb droplet;
Au/spl bsol/Ni/spl bsol/Cu pad;
SEM;
intermetallic compounds;
solder ball;
bump fabrication;
pad temperature field;
finite element method;
contact temperature;
Au-Ni-Cu;
SnPb;
7.
Considerations for MEMS packaging
机译：
考虑MEMS包装
作者：
Biye Wang
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
micromechanical devices;
packaging;
MEMS packaging;
MEMS device topography;
delicate moving parts;
microelectronic;
media contact;
media interaction;
sensing;
actuation;
wafer level packaging;
die level packaging;
hermeticity;
8.
Buckle-driven delamination of thin film and the influence of the Casimir or van der Waals force interaction
机译：
扭转的分层薄膜和Casimir或Van der WaaS力相互作用的影响
作者：
Yu Shouwen
;
Li Qunyang
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
semiconductor thin films;
delamination;
van der Waals forces;
buckling;
finite element analysis;
buckle-driven delamination;
thin film delamination;
Casimir force interaction;
van der Waals force interaction;
indentation test;
thin film interfacial adhesion;
linear elastic fracture mechanics;
post-buckling theory;
post-buckling response;
FEM calculation;
double-buckling response;
strain energy release rate;
post-buckling behavior;
9.
New developments in stacked die CSPs
机译：
堆叠模具CSP中的新发展
作者：
Jan Vardaman E.
;
Matthew L.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
chip scale packaging;
integrated circuit packaging;
memory architecture;
logic devices;
integrated circuit economics;
flip-chip devices;
portable applications;
small form-factors;
stacked die packages;
mobile phone;
digital camera;
stacked die CSP;
personal digital assistants;
Fujitsu Microelectronics;
ChipPAC;
Intel;
wire bonded packages;
flip chip;
semiconductor makers;
IC package;
memory packages;
flash memory;
SRAM packages;
logic devices;
fast turn-time;
low NRE costs;
stacked die products;
logistical issues;
engineering issues;
wafer thinning;
bare die;
die attach;
wire bond;
thermal dissipation;
10.
Simulation on electroosmotic flow through a rectangular microchannel with different aspect ratios
机译：
通过矩形微通道具有不同纵横比的矩形流动模拟
作者：
Zhang Peng
;
Zuo Chuncheng
;
Zhou Deyi
;
Pan He
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
flow simulation;
microfluidics;
micropumps;
osmosis;
Poisson equation;
Boltzmann equation;
Navier-Stokes equations;
Debye-Huckel theory;
electroosmotic flow;
microchannel;
2D Poisson-Boltzmann equation;
2D Navier-Stokes equation;
electric double layer field;
velocity field;
SIMPLE method;
Debye-Huckel approximation;
volumetric flowrate;
aspect ratios;
hydraulic diameter;
channel cross-section geometry;
electroosmotic pumping;
11.
A BS-BIST test circuit design for VAD-SOC
机译：
BS-IS VAD-SOC的测试电路设计
作者：
Li Jianfeng
;
Zhang Jinyi
;
Li Jiao
;
Yan Laijin
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
system-on-chip;
integrated circuit testing;
built-in self test;
boundary scan testing;
circuit complexity;
BS-BIST test circuit design;
VAD-SOC;
integrated circuit system;
intelligent properties;
system on chip system;
built in self test;
boundary-san technique;
circuit complexity;
video add data SOC;
12.
Packaging and board assembly technology trend and impact on the supply chain
机译：
包装和板组装技术趋势与对供应链的影响
作者：
Shangguan D.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
printed circuit manufacture;
packaging;
supply chain management;
packaging technology;
board assembly technology;
supply chain;
miniaturization;
functional densification;
functional integration;
environmental friendliness;
product packaging;
time-to-market requirement;
product categories;
13.
Studies of microstructure characteristics and evolutions at the bond interface in bonding technology
机译：
粘接技术中粘合界面的微观结构特征及演进研究
作者：
Li Jun-Hui
;
Han Lei
;
Zhong Jue
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
ultrasonic bonding;
scanning electron microscopes;
integrated circuit interconnections;
gold alloys;
silver alloys;
aluminium alloys;
microstructure characteristics;
bond interface;
bonding technology;
thermosonic bond development;
scanning electron microscope;
EDS-test;
bond strength;
constant force;
constant time;
bond pattern;
ridged location;
Au-Al microstructures;
Au-Ag microstructures;
Kirkendall diffusibility;
Au-Ag interface;
intermetallic compounds;
Au-Al interface;
Au-Al;
Au-Ag;
14.
Characterisation of intermetallics and mechanical behaviour in the reaction between SnAgCu and Sn-Pb solder alloys
机译：
SnAGCU与SN-PB焊料合金反应中金属间化物质和机械性能的特征
作者：
Zhiheng Huang
;
Changqing Liu
;
Conway P.
;
Thomson R.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
solders;
eutectic structure;
mechanical properties;
electron backscattering;
optical microscopy;
scanning electron microscopy;
surface morphology;
hardness;
elastic moduli;
creep;
tin compounds;
intermetallics characterization;
mechanical behaviour;
solder alloys;
Pb-free solders;
materials properties;
solder joints manufacturing;
solder joints reliability;
electronics packaging;
reliable products processes;
Sn-Pb-to-Pb-free soldering;
Pb contamination;
resulting microstructure;
microstructure properties;
unknown compositions;
unknown structures;
tolerable levels;
relative content;
intermetallic phases;
thermodynamic calculations;
multicomponent material behaviour;
intermetallic precipitates formation;
Sn-3.9Ag-0.6Cu alloys;
405 alloy;
Sn-3.0Ag-0.5Cu alloys;
305 alloy;
contamination levels;
eutectic Sn-37Pb solder;
eutectic SnPb solder;
phase identification;
optical microscopy;
scanning electron microscopy;
electron back scattered diffraction;
phase morphology;
phase orientation;
nanoscales;
nanoindentation;
ultra-fine microstructures;
complex microstructures;
micromechanical properties;
hardness property;
elastic modulus;
creep property;
ambient temperature;
elevated temperatures;
SnAgCu;
SnPb;
15.
Thermal analysis for multichip module using computational fluid dynamic simulation
机译：
使用计算流体动态模拟的多芯片模块的热分析
作者：
Cheng Yingjun
;
Zhu Wenjie
;
Zhu Rui
;
Xu Gaowei
;
Luo Le
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
multichip modules;
thermal analysis;
computational fluid dynamics;
thermal properties;
materials properties;
thermal analysis;
multichip module;
computational fluid dynamic simulation;
heat flux;
package levels;
thermal performance;
high density electronic packages;
CFD model;
temperature distribution;
thermal characteristics;
indirect liquid cooling;
supercomputer;
material properties;
thermal grease;
thermal interface material;
package geometry;
solder bump;
solder ball patterns;
flow rate;
inlet liquid temperature;
chip temperature;
16.
Microstructure evolution and shear strength of Sn-3.5Ag-RE lead-free BGA solder balls
机译：
SN-3.5AG-RE无铅BGA焊球的微观结构演化与剪切强度
作者：
Law C.M.T.
;
Wu C.M.L.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
solders;
ball grid arrays;
shear strength;
reflow soldering;
ductile fracture;
ageing;
interface structure;
chemical interdiffusion;
surface treatment;
rare earth compounds;
tin compounds;
microstructure evolution;
Sn-3.5Ag-RE lead-free solder;
BGA solder balls;
interfacial microstructure;
ball shear strength;
Sn-3.5Ag solder;
ball grid array;
BGA metallization pad;
thermal aging;
intermetallic compounds;
rare earth elements;
RE-bearing phase;
intermetallic layer;
ball shear strengths;
as-reflowed shear strength;
microstructure refinement;
Pb-bearing solders;
fracture mode;
ductile failure;
bulk solder;
150 C;
1000 hr;
AuSn/sub 4/;
Ag/sub 3/Sn;
Ni/sub 3/Sn/sub 4/;
17.
Relationship between curing conditions and interconnect properties of flexible printed circuit/glass substrate joints using anisotropic conductive films
机译：
柔性印刷电路/玻璃基板接头使用各向异性导电膜的关系与柔性印刷电路/玻璃基板接头的关系
作者：
Inoue M.
;
Miyamoto T.
;
Suganuma K.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
integrated circuit interconnections;
printed circuits;
flip-chip devices;
polymer films;
substrates;
curing;
integrated circuit bonding;
mechanical properties;
electric properties;
curing condition;
interconnect properties;
flexible printed circuit;
glass substrate joints;
anisotropic conductive films;
mechanical properties;
electrical properties;
anisotropic conductive film;
ACF interconnects;
bonding conditions;
curing behavior analysis;
time-temperature-superposition;
superposition principle;
curing kinetics analysis;
shift factor;
glass transition temperature;
ACF joint peel strength;
binder polymer structure;
adhesive binder;
bonding temperature;
electrical connection;
18.
Materials and processes issues in fine pitch eutectic solder flip chip interconnection
机译：
精细间距共晶焊料倒装芯片互连中的材料和过程问题
作者：
Liu C.
;
Hendriksen M.W.
;
Hutt D.A.
;
Conway P.P.
;
Whalley D.C.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
integrated circuit interconnections;
chip-on-board packaging;
fine-pitch technology;
soldering;
eutectic structure;
printing;
flip-chip devices;
fine pitch eutectic solder;
flip chip interconnection;
electronics packaging industry;
interconnect demand;
microscopic geometry;
integrated circuit level;
supporting board level;
flip chip on board applications;
competitive manufacturing costs;
robust production capability;
surface mount technology;
under bump metallisation;
stencil printing solder bumping;
electrical resistance;
electroless Ni plating;
solder paste deposition;
joint geometry reduction;
stencil paste printing;
bump formation;
bump shear strength;
squeegees;
wafer fixtures;
optimisation;
bumping defect reduction;
Ni;
19.
Technology development and basic theory study of fluid dispensing - a review
机译：
流体分配技术开发与基本理论研究 - 综述
作者：
Li Jianping
;
Deng Guiling
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
packaging;
fluids;
fluid dispensing;
chip package;
circuit assembly;
time-pressure dispensing;
auger pump dispensing;
piston valve dispensing;
jetting dispensing;
technology development;
packaging;
20.
Experimental study of component placement in solder paste
机译：
焊膏中组分放置的实验研究
作者：
Djurovic Z.
;
Dahlberg M.
;
Anderson J.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
solders;
assembling;
printed circuit manufacture;
surface mount technology;
solder paste;
pick-and-place machine;
Mydata automation AB;
MY9;
mounting device;
mounting speed;
component placement speed;
mounting arrangement;
size 0605;
size 1206;
SO 14;
SO 16;
assembling;
mounting force;
0201 components;
mounting accuracy;
Mydata Accur measurement programme;
PCB production line;
PCB assembly;
Chalmers-IVF;
Molndal;
tackiness tests;
Mydata lab;
21.
Micro-semiconductor tactile sensor for the automatic obstacle-avoidance system of endoscope
机译：
用于内窥镜的自动障碍物避免系统的微半导体触觉传感器
作者：
Shen Linyong
;
Qian Jinwu
;
Zhang Zhen
;
Zhang Yanan
;
Yin Jinxi
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
tactile sensors;
microsensors;
endoscopes;
elemental semiconductors;
semiconductor devices;
silicon;
tactile sensor;
obstacle avoidance;
sensor design;
intelligent endoscope;
MEMS technology;
micro silicon semiconductor;
Si;
22.
Design of a high performance microcontroller
机译：
高性能微控制器的设计
作者：
Hu Yue-li
;
Cao Jia-lin
;
Ran Feng
;
Liang Zhi-jian
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
microcontrollers;
combinational circuits;
CMOS integrated circuits;
instruction sets;
logic gates;
electronic design automation;
high performance microcontroller;
instruction set;
Intel 8051;
system architecture;
clock period per machine cycle;
Harvard architecture;
pre-fetching instruction method;
MCU power efficiency;
CPU architecture;
ALU;
combinational circuits;
multiplier module;
divider module;
multiclocks architectures;
hardwired control unit;
gating clock method;
power consumption reduction;
CMOS technology;
EDA tools;
FPGA;
Altera APEX20KE;
IP core;
MCU core;
SOC;
8 bit;
0.6 micron;
23.
Design and implementation of system-on-package for radio and mixed-signal applications
机译：
用于无线电和混合信号应用程序系统的系统上的设计与实现
作者：
Li-Rong Zheng
;
Xingzhong Duo
;
Meigen Shen
;
Torrika T.
;
Michielsen W.
;
Tenhunen H.
;
Liu Chen
;
Gang Zou
;
Johan Liu
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
radio receivers;
liquid crystal polymers;
system-on-chip;
wireless LAN;
system-on-package design;
radio applications;
mixed-signal applications;
wireless applications;
logistics aplications;
intelligent home networks;
smart dusts;
wireless body area networks;
digital CMOS circuits;
analog circuits;
RF circuits;
integration platform;
system-on-chip integration;
liquid-crystal polymer materials;
RF SoP;
RF receiver front-end;
passive components;
superior RF performance;
on-chip-off-chip passives;
multiband multistandard radio;
3G applications;
complex radio;
chip-package co-design;
smart parasitic absorption;
RF module;
ultra-wide band radio;
gigabit wireless;
SoP pacemaker;
system level integration;
low-cost wireless integration;
good-performance wireless integration;
5 GHz;
24.
Integrated MEMS technology
机译：
集成MEMS技术
作者：
Cai Ran
;
Xue Cai
;
Fu Jin
;
Hu Yu
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
micromechanical devices;
packaging;
MEMS technology integration;
integrated low-loss MEMS;
optical-electrical micro-transducers;
optimum arraying;
photoelectric conversion efficiency;
data source;
signal-to-noise ratio;
optical micro-units;
reliability;
stability;
segmented stage packaging;
vector adaptive finding;
EVAF;
SVAF;
wireless services;
low cost implementation;
graininess measuring technology;
real-time processing;
25.
On-chip versus off-chip passives analysis in radio and mixed-signal system-on-package design
机译：
电池上的片内使用的无线电和混合信号系统上的外包装设计
作者：
Xinzhong Duo
;
Li-Rong Zheng
;
Ismail M.
;
Tenhunen H.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
VLSI;
wireless LAN;
mixed analogue-digital integrated circuits;
radiofrequency amplifiers;
radiofrequency integrated circuits;
packaging;
system-on-chip;
on-chip versus off-chip passives analysis;
radio system-on-package design;
mixed-signal system-on-package design;
VLSI;
packaging technologies;
system level integration;
chip-package constraints;
systematic design;
RF SoP;
RF SoC;
design implementation;
performance estimation;
cost estimation;
design techniques;
common emitter low noise amplifier;
wireless LAN;
analytical equations;
noise figure;
transducer gain;
lossy package;
5 GHz;
26.
Technology development and basic theory study of fluid dispensing - a review
机译：
流体分配技术开发与基本理论研究 - 综述
作者：
Li Jianping
;
Deng Guiling
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
packaging;
fluids;
fluid dispensing;
chip package;
circuit assembly;
time-pressure dispensing;
auger pump dispensing;
piston valve dispensing;
jetting dispensing;
technology development;
packaging;
27.
Characterisation of metal-coated polymer spheres and its use in anisotropic conductive adhesive
机译：
金属涂层聚合物球体的表征及其在各向异性导电粘合剂中的用途
作者：
Kristiansen H.
;
Gronlund T.O.
;
Liu J.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
adhesives;
conducting polymers;
mechanical properties;
electric properties;
metal coated polymer spheres;
anisotropic conductive adhesive;
electrical properties;
mechanical properties;
28.
Technology for flipchip assembly on moulded interconnect devices (MID)
机译：
模压互连装置上的触发器组件技术（中间）
作者：
Kessler U.
;
Kuck H.
;
Eberhardt W.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
flip-chip devices;
integrated circuit interconnections;
adhesives;
polymers;
substrates;
flipchip assembly;
moulded interconnect devices;
MEMS;
MOEMS;
die assembly;
chip-on-MID;
adhesive technology;
electroless plated polymer substrates;
moulded polymer bumps;
transition resistance;
flipchip contacts;
process quality;
temperature shock;
humidity storage testing;
expansion thermal coefficient;
29.
Simulation on electroosmotic flow through a rectangular microchannel with different aspect ratios
机译：
通过矩形微通道具有不同纵横比的矩形流动模拟
作者：
Zhang Peng
;
Zuo Chuncheng
;
Zhou Deyi
;
Pan He
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
flow simulation;
microfluidics;
micropumps;
osmosis;
Poisson equation;
Boltzmann equation;
Navier-Stokes equations;
Debye-Huckel theory;
electroosmotic flow;
microchannel;
2D Poisson-Boltzmann equation;
2D Navier-Stokes equation;
electric double layer field;
velocity field;
SIMPLE method;
Debye-Huckel approximation;
volumetric flowrate;
aspect ratios;
hydraulic diameter;
channel cross-section geometry;
electroosmotic pumping;
30.
Diamond film/alumina composites used as the packaging material in integrated circuits with ultra-high speed and high power
机译：
金刚石胶片/氧化铝复合材料用作集成电路的包装材料，具有超高速和高功率
作者：
Yiben Xia
;
Linjun Wang
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
integrated circuit packaging;
composite materials;
ion implantation;
chemical vapour deposition;
CVD coatings;
thermal conductivity;
dielectric properties;
diamond;
alumina;
diamond film;
alumina composites;
packaging material;
integrated circuits;
substrate materials;
compressive stress;
hot filament chemical vapour deposition;
ion implantation;
carbon ions;
C+ implantation dose;
dielectric properties;
dielectric constant;
dielectric loss;
frequency stability;
thermal conductivity;
film deposition;
31.
On the formation of Cu-Ni-Sn ternary intermetallics in SMT solder joints
机译：
SMT焊点中Cu-Ni-Sn三元金属间金属间金属间金属间金属间金属间金属间
作者：
Xiaoming Xie
;
Yanhhua Xia
;
Junling Chang
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
interface structure;
melting;
chemical interdiffusion;
solders;
eutectic structure;
metallisation;
copper alloys;
tin compounds;
eutectic alloys;
ternary intermetallics;
SMT solder joints;
intermetallics formation;
SnPb eutectic solder;
sandwich structure;
copper pad;
HASL finish;
solder material;
metallization reaction;
soldering interface;
ternary alloy;
intermetallic compounds;
solder joint thickness;
SnPb-CuNiSn;
32.
The effects of laser reflow conditions on the formation of intermetallic compounds at Sn3.0Ag0.5Cu solder/Cu joint interface
机译：
激光回流条件对SN3.0AG0.5CU焊料/ Cu关节界面形成金属间化合物的影响
作者：
Wei Liu
;
Chunqing Wang
;
Mingyu Li
;
Yanhong Tian
;
Jingwei Guan
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
reflow soldering;
chemical interdiffusion;
solders;
surface morphology;
interface structure;
tin compounds;
laser reflow conditions;
intermetallic compounds formation;
Sn3.0Ag0.5Cu solder;
joint interface;
hot air reflow processes;
laser reflow solder joints;
laser reflow power;
heating time;
SnAgCu-Cu;
33.
Relationship between curing conditions and interconnect properties of flexible printed circuit/glass substrate joints using anisotropic conductive films
机译：
柔性印刷电路/玻璃基板接头使用各向异性导电膜的关系与柔性印刷电路/玻璃基板接头的关系
作者：
Inoue M.
;
Miyamoto T.
;
Suganuma K.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
integrated circuit interconnections;
printed circuits;
flip-chip devices;
polymer films;
substrates;
curing;
integrated circuit bonding;
mechanical properties;
electric properties;
curing condition;
interconnect properties;
flexible printed circuit;
glass substrate joints;
anisotropic conductive films;
mechanical properties;
electrical properties;
anisotropic conductive film;
ACF interconnects;
bonding conditions;
curing behavior analysis;
time-temperature-superposition;
superposition principle;
curing kinetics analysis;
shift factor;
glass transition temperature;
ACF joint peel strength;
binder polymer structure;
adhesive binder;
bonding temperature;
electrical connection;
34.
The effect of residual stress on the flexing strength of PCB assembly
机译：
残余应力对PCB组件弯曲强度的影响
作者：
Jun Wang
;
Ping He
;
Fei Xiao
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
printed circuits;
assembling;
stress effects;
bending;
bending strength;
finite element analysis;
failure analysis;
residual stress effect;
flexing strength;
surface mount technology;
reflow;
baking;
thermal expansion coefficient;
CTE mismatch;
packaging layers;
solder joint interconnect strength;
PCB assembly structure;
PCB assembly test vehicle;
solder balls;
three-point bending test;
finite element analysis;
failure analysis;
critical bending force;
35.
An experimental system for the mechanism research of contact fluid dispensing dot
机译：
接触流体分配点机理研究的实验系统
作者：
Deng GuiLing
;
Xie JingHua
;
Zhong Jue
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
fluid dynamics;
contact fluid dispensing dot;
microelectronic packaging;
black box model;
phasing study;
fluid dynamic evolvement;
fluid dynamics;
high speed imaging system;
mechanical system;
control system;
measurement system;
pneumatic system;
36.
A novel surface passivation process for CdZnTe detector packaging
机译：
CDZNTE检测器包装的新型表面钝化过程
作者：
Sang Wenbin
;
Jin Wei
;
Zhang Qi
;
Min Jiahua
;
Zhang Minglong
;
Teng Jianyong
;
Qian Yongbiao
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
sensors;
packaging;
passivation;
surface treatment;
plasma CVD;
Raman spectroscopy;
diamond-like carbon;
cadmium compounds;
surface passivation process;
CdZnTe detector packaging;
microstrip detector packaging;
detector performance;
spectral energy resolution;
device packaging;
diamond like carbon film;
radio frequency plasma chemical vapor deposition method;
AFM;
AES;
microRaman Spectroscopy;
ZC36 microcurrent testing instrument;
interstrip resistance;
coplanar grid detector;
CdZnTe;
37.
Design and implementation of RS(255,223) decoder on FPGA
机译：
FPGA上RS（255,223）解码器的设计与实现
作者：
Yan Laijin
;
Li Ming
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
decoding;
field programmable gate arrays;
data communication equipment;
FPGA;
RS(255,223) decoder;
high-speed data communication;
Euclidean algorithm;
Chien search;
Forney algorithm;
parallel processing technology;
38.
Sustainable development of microelectronic technology processes integration of ecodesign
机译：
微电子技术流程的可持续发展生态技术的整合
作者：
Griese H.
;
Schischke K.
;
Reichl H.
;
Stobbe L.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
integrated circuit packaging;
microassembling;
optimisation;
design for manufacture;
sustainable development;
microelectronic technology;
ecodesign integration;
environmental requirements;
sustainability;
eco-efficiency;
manufacturing process design;
material choice;
process evaluation;
estimated production volume;
production cost;
optimised solution;
ecodesign experts;
inefficient development identification;
cost reduction;
technologist-ecodesigner cooperation;
waferlevel bumping packaging;
smart tag production;
39.
Thermal-issues for design of high power SiC MESFETs
机译：
高功率SiC MESFET设计的热问题
作者：
Liu W.
;
Zetterling C.M.
;
Ostling M.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
power MESFET;
semiconductor device models;
thermal resistance;
thermal management (packaging);
silicon compounds;
wide band gap semiconductors;
SiC MESFET design;
power MESFET;
RF source;
power amplifiers;
wireless telecommunication systems;
phased-array radar systems;
material properties;
electrical field;
electron saturation velocity;
thermal conductivity;
self-heating;
DC performance;
gate fingers;
2D electro-thermal simulations;
ISE-TCAD;
drain current;
transistors;
power density;
thermal simulations;
FEMLAB;
junction temperature;
gate periphery;
die backside;
packaging thermal resistance;
die thermal resistance;
4.5 W;
SiC;
40.
Characterisation of metal-coated polymer spheres and its use in anisotropic conductive adhesive
机译：
金属涂层聚合物球体的表征及其在各向异性导电粘合剂中的用途
作者：
Kristiansen H.
;
Gronlund T.O.
;
Liu J.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
adhesives;
conducting polymers;
mechanical properties;
electric properties;
metal coated polymer spheres;
anisotropic conductive adhesive;
electrical properties;
mechanical properties;
41.
Packaging and board assembly technology trend and impact on the supply chain
机译：
包装和板组装技术趋势与对供应链的影响
作者：
Shangguan D.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
printed circuit manufacture;
packaging;
supply chain management;
packaging technology;
board assembly technology;
supply chain;
miniaturization;
functional densification;
functional integration;
environmental friendliness;
product packaging;
time-to-market requirement;
product categories;
42.
Microstructure evolution and shear strength of eutectic Sn-9Zn and Sn-0.7Cu lead-free BGA solder balls
机译：
共晶SN-9ZN和SN-0.7CU无铅BGA焊球的微观结构演化与剪切强度
作者：
Wu C.M.L.
;
Law C.M.T.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
solders;
eutectic structure;
ageing;
shear strength;
interface structure;
eutectic alloys;
zinc compounds;
tin compounds;
eutectic Sn-9Zn;
eutectic Sn-0.7Cu;
lead-free BGA solder balls;
solder alloy;
eutectic temperature;
eutectic Sn-37Pb;
good solderability properties;
creep properties;
ball grid array;
Sn-9Zn solder balls;
Sn-0.7Cu solder balls;
BGA metallization pad;
interfacial microstructure evolution;
bulk microstructure;
intermetallic compounds;
ternary intermetallic layer;
aging time;
bulk solder;
thermal aging;
Pb-free systems;
ball shear strength;
Pb-bearing solder alloys;
199 C;
183 C;
150 C;
1 micron;
500 hours;
AuNiCu;
AuSn/sub 4/;
AuZn;
NiZnSn;
Cu/sub 6/Sn/sub 5/;
CuSnNi;
Ni/sub 6/Sn/sub 5/;
CuSnAu;
43.
Computer-based data acquisition for wire bonding studies
机译：
基于计算机的线粘合研究数据采集
作者：
Wang Fu-liang
;
Han Lei
;
Zhong Jue
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
integrated circuit bonding;
integrated circuit interconnections;
circuit CAD;
transducers;
data acquisition;
digital storage oscilloscopes;
computer-based data acquisition;
wire bonding studies;
ultrasonic bonding;
interconnect technology;
microelectronics manufacturing;
data transfer;
digital storage oscilloscope;
RS232 serial communications;
transducer;
44.
Microsystem manufacturing, assembly and packaging technology in Display-Card/spl trade/ applications
机译：
微系统制造，装配和包装技术在显示卡/拼接贸易/应用中
作者：
Duan J.
;
Asplund J.
;
Liu J.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
smart cards;
micromechanical devices;
assembling;
packaging;
microsystem manufacturing;
assembly;
packaging technology;
Display-Card/spl trade/ applications;
SWECARD Display-Card/spl trade/;
standard credit card;
information storage;
airline tickets;
bankcards;
loyalty cards;
health cards;
security/ID cards;
short circuit;
45.
Reliability investigations for encapsulated isotropic conductive adhesives flip chip interconnection
机译：
封装各向同性导电粘合剂的可靠性调查倒装芯片互连
作者：
Liu Chen
;
Zonghe Lai
;
Zhaonian Cheng
;
Johan Liu
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
adhesives;
flip-chip devices;
failure analysis;
finite element analysis;
viscoelasticity;
reliability investigations;
encapsulated isotropic conductive adhesives;
flip chip interconnection;
electronic manufacturing;
failure mechanism;
product lifetime measurement;
cross section observation;
module warpage scanning;
chip-size effect;
ICA lifetime;
warpage measurement;
shear stress;
ICA reliability;
finite element method;
visco-elastic models;
adhesives models;
underfill materials;
elastic model;
lifetime relationship;
Coffin-Manson formula;
thermal fatigue life;
encapsulated ICA flip chip;
46.
Multifunctional integrated substrate technology for high density SOP packaging
机译：
高密度SOP包装的多功能集成基板技术
作者：
Fuhan Liu
;
Tummala R.R.
;
Sundaram V.
;
Guidotti D.
;
Zhaoran Huang
;
Chang Y.-J.
;
Abothu I.R.
;
Raj P.M.
;
Bhattacharya S.
;
Balaraman D.
;
Chang G.K.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
printed circuit manufacture;
packaging;
substrates;
metallisation;
integrated optoelectronics;
multifunctional integrated substrate;
high density SOP packaging;
printed circuit boards;
advanced IC packages;
BGA package;
CSP package;
flip chip packages;
wafer-level package;
MCM;
3D package;
system-in-package;
system-on-package;
high density microelectronic systems;
nanometer-size features;
processor clock;
system level substrates;
wiring density;
high performance requirements;
packaging research center;
Georgia Tech;
high density systems;
high performance systems;
ultra-high density wiring;
ultra fine circuit traces;
ultra fine microvias;
nonconformal stacked vias;
fine pitch application;
high I/O count;
flip chip application;
microsystem miniaturization;
passive components integration;
high speed optical interconnects;
chip-to-chip data link;
ultra-fine lines;
ultra-fine space;
stacked microvias;
optically smooth organic surfaces;
optical components integration;
chip-to-chip data rate;
optoelectronics integration;
10 Gbit/s;
47.
Reliability predictions for high density packaging
机译：
高密度包装的可靠性预测
作者：
Bailey C.
;
Stoyanov S.
;
Lu H.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
packaging;
semiconductor device reliability;
flip-chip devices;
ball grid arrays;
reliability predictions;
high density packaging;
newly designed products;
design variables;
expenditure optimization;
electronics industry;
historical field data;
industrial databases;
industrial specifications;
MIL-HDBK-217 standard;
high density flip-chip;
BGA components;
design parameters;
48.
Effects of contact metallizations on electrical resistance reliability of ACF interconnection for chip on flex application
机译：
接触金属化对芯片芯片互联电阻可靠性的影响
作者：
Jianhua Zhang
;
Chan Y.C.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
adhesives;
integrated circuit interconnections;
integrated circuit metallisation;
integrated circuit reliability;
electrical contacts;
contact resistance;
flip-chip devices;
electric resistance;
nickel alloys;
copper alloys;
contact metallization;
electrical resistance reliability;
ACF interconnection;
anisotropically conductive adhesives;
anisotropically conductive films;
ACA interconnection;
flip chip assembly;
interconnection reliability;
flex substrate;
bump/pad metallizations couple;
contact resistance;
reliability tests;
humidity;
temperature;
thermal cycling;
Ni-Cu coupled metallization;
49.
Electrical conductive characteristics of ACA bonding: a review of the literature, current challenges and future prospects
机译：
ACA键合的导电特性：对文献，当前挑战与未来前景的综述
作者：
Guangbin Dou
;
Whalley D.C.
;
Changqing Liu
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
integrated circuit bonding;
integrated circuit interconnections;
adhesives;
electrical conductivity;
electric resistance;
electrical conductive characteristics;
ACA bonding;
anisotropic conductive adhesives;
fine pitch electronics packaging;
ACA particle;
conductive mechanism;
computational models;
mathematical models;
physical models;
particle contact area;
constriction resistance;
particle deformation;
electronics interconnection technology;
50.
Microsystems packaging from milli to microscale to nanoscale
机译：
从米尔到Micross ina校准的MicroSystems包装
作者：
Tummala R.R.
;
Markondeya Raj P.
;
Sundaram V.
会议名称：
《IEEE CPMT Conference on High Density Microsystem Design and Packaging and Component Failure Analysis》
|
2004年
关键词：
integrated circuit packaging;
nanotechnology;
system-on-chip;
integrated circuit reliability;
integrated circuit interconnections;
circuit complexity;
electronic products;
microsystems packaging;
milliscale packaging;
microscale packaging;
nanoscale packaging;
I/O connections;
semiconductor devices;
board assembly;
IC packaging;
end product systems;
cell phones;
PDA;
laptops;
systems packaging;
interconnections;
board level packaging;
IC devices;
SOC;
system-on-chip technology;
multiple systems functions;
single chip;
2D integration;
IC blocks;
system-level functionality;
design complexity;
computing limits;
integration limits;
wireless systems;
3D packaging;
system-in-package;
IC integration;
CMOS processing;
miniaturization;
portable electronic products;
desktop electronic products;
SOP;
system-on-package technology;
Georgia Tech PRC;
optimize silicon;
IC-package-system co-design;
cost optimizations;
performance optimization;
reliability optimization;
computing limitations;
integration limitations;
global wiring;
RF component integration;
optical component integration;
package level;
embedded digital components;
miniaturized package;
miniaturized module;
miniaturized board;
convergent systems;
Moore Law;
component density;
microscale thin film component integration;
nanoscale integration;
意见反馈
回到顶部
回到首页
