DESIGN OF DISPLAY DRIVER IC AND ITS PACKAGING METHOD OF STABLE CONTACT RESISTANCE COG (CHIP ON GLASS) AND COF (CHIP ON FLEX) INTERCONNECTION USING ANISOTROPIC CONDUCTIVE ADHESIVES

摘要

Design of a liquid crystal driver circuit connection bump structure having a stable contact resistance between a connection bump and a substrate conductive layer pattern and COG (Chip on glass) and COF (Chip on flex) interconnection method using anisotropic conductive adhesive are provided to prevent mounting failure of a liquid crystal driver chip and maintain strong connection for a long time by generating uniform deformation of conductive particles between a connection bump and a substrate conductive layer throughout an entire area of a driver chip when mounting the driver chip on a substrate. Input terminals and output terminals are formed such that respective entire areas of the input terminals and the output terminals formed in a connection bump(102) are equal to each other. The bump sizes of the input terminals and the output terminals formed at the connection bump are different. The output terminal has a staggered bump layout in order to prevent short-circuit between the bumps due to an extremely fine interval.