silicon; elemental semiconductors; electrical resistivity; chip scale packaging; thin film inductors; Q-factor; permittivity; thermal conductivity; UHF antennas; mobile antennas; mechanical stability; losses; radio equipment; substrates; wafer-level integration; on-chip antennas; RF passives; high-resistivity polysilicon substrate technology; HRPS wafers; low-loss substrates; 3D integration; RF inductors; wafer-level chip-scale packages; WLCSP; silicon wafers; conductive silicon substrate; mechanical stability; form factor; RF loss; antenna performance; glass substrates; quality factors; spiral inductors; dielectric constant; thermal conductivity; thermal matching; 150 micron; 1 GHz; Si;
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