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On-chip integration of passive and active optical components enabled by hydrogenation
On-chip integration of passive and active optical components enabled by hydrogenation
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机译:通过氢化实现无源和有源光学组件的片上集成
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摘要
A method and structure for integrating many optical devices on a single wafer is described. The method fabricates passive interconnect devices using hydrogenation techniques. Lateral optical confinement is achieved by hydrogenating regions laterally adjacent to the waveguide core. Vertical optical confinement is adjusted by careful control of the hydrogen content of the waveguide core itself.
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