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Performance and Scaling of a Dense Plasma Focus Light Source for EUV Lithography

机译:用于EUV光刻的密集等离子聚焦光源的性能和缩放

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A commercially viable light source for EUV lithography has to meet the large set of requirements of a High Volume Manufacturing (HVM) lithography tool. High optical output power, high-repetition rate, long component lifetime, good source stability, and low debris generation are among the most important parameters. The EUV source, being developed at Cymer, Inc. is a discharge produced plasma source in a dense plasma focus (DPF) configuration. Promising results with Xe as a working gas were demonstrated earlier. To scale the DPF parameters to levels required for HVM our efforts are concentrated on the following areas: (1) thermal engineering of the electrodes utilizing direct water cooling techniques; (2) development of improved pulsed power systems for > 4 kHz operation; (3) study of erosion mechanisms for plasma facing components; (4) development of efficient debris mitigation techniques and debris shields; (5) studies of plasma generation and evolution with emphasis on improving conversion efficiency and source stability; (6) development of EUV metrology techniques and instrumentation for measurements of source size; and (7) development of an optimized collector optic matched to our source parameters. In this paper, we will present results from each of these key areas. The total in-band EUV output energy now approaches 60 mJ/pulse into 2π sr and the conversion efficiency has been increased to near 0.5%. Routine operation at 4 kHz in burst-mode, and continuous operation at 1 kHz has been demonstrated. Improved at-wavelength source metrology now allows a determination of EUV source size utilizing imaging, and monitoring of key features of the spectrum on a pulse-to-pulse basis. With effective suppression of debris generated from the anode by several orders of magnitude, UV/EUV-catalyzed carbon growth now presents the limit in producing a clean source.
机译:用于EUV光刻的商业上可行的光源必须满足大容量制造(HVM)光刻工具的大量要求。高光输出功率,高重复率,长部件寿命,良好的源稳定性和低碎屑生成是最重要的参数。在Cymer,Inc。开发的EUV源是致密等离子体聚焦(DPF)配置中的排出产生的等离子体源。提前证明了与XE作为工作气体的有希望的结果。为了将DPF参数扩展到HVM所需的水平,我们的努力集中在以下领域:(1)利用直接水冷却技术的电极的热工程; (2)开发> 4 kHz操作的改进的脉冲电力系统; (3)研究等离子体面向组件的腐蚀机制; (4)高效的碎片减缓技术和碎片盾牌的开发; (5)对等离子体生成和进化的研究重点改善转化效率和源稳定性; (6)开发EUV计量技术和仪器测量源大小的仪器; (7)开发与我们的源参数相匹配的优化收集器视图。在本文中,我们将提出每个关键领域的结果。现在的带内EUV输出能量现在将60 MJ /脉冲接近2πSR,转化效率增加到接近0.5%。在突发模式下以4 kHz的例程操作,并证明了1 kHz的连续操作。改进的处于波长源计量计量现在允许确定使用成像的EUV源大小,并在脉冲到脉冲的基础上监视光谱的关键特征。通过几个数量级,UV / EUV催化的碳生长有效抑制从阳极产生的阳极产生的碎片现在呈现了制备清洁源的极限。

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