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A numerical study of the effect of die, die pad and die attach thicknesses on thin plastic packages

机译：芯片，芯片焊盘和芯片附着厚度对薄塑料封装影响的数值研究

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《Electronic Components and Technology Conference, 2002. Proceedings. 52nd》|2002年|P.199-204|共6页
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Tay A.A.O.; Zhu H.;
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中图分类无线电电子学、电信技术;
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