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Short-pulse propagation technique for characterizing resistive package interconnections

机译:表征电阻封装互连的短脉冲传播技术

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A novel technique for completely characterizing the frequency-dependent electrical properties of resistive transmission lines by short-pulse propagation is described. Time-domain measurements of the loss and dispersion of pulses propagated on two different lengths of the line under investigation, together with the measured low-frequency capacitance, are used to determine its broadband complex propagation constant and complex impedance. The technique is illustrated with measurements on a thin-film package interconnection structure. The measured line characteristics are then used in a transient circuit analysis program to predict output waveforms generated by logiclike signals. In the absence of modeling capabilities, the measured results can be used directly as input to circuit simulation programs. The authors illustrate this with the response of a 9.65-cm-long thin-film line to logiclike signals.
机译:描述了一种通过短脉冲传播完全表征电阻传输线的频率相关电特性的新颖技术。在所研究的线路的两个不同长度上传​​播的脉冲的损耗和色散的时域测量以及所测得的低频电容,用于确定其宽带复数传播常数和复数阻抗。通过在薄膜封装互连结构上的测量来说明该技术。然后,在瞬态电路分析程序中使用测得的线路特性来预测由类似逻辑的信号生成的输出波形。在没有建模功能的情况下,测量结果可以直接用作电路仿真程序的输入。作者用一条9.65厘米长的薄膜线对类似逻辑的信号的响应来说明这一点。

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