首页> 外文会议>Indium Phosphide and Related Materials, 1991., Third International Conference. >Low temperature deposition of SiO/sub 2/ on InP substrates by DECR PECVD
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Low temperature deposition of SiO/sub 2/ on InP substrates by DECR PECVD

机译:通过DECR PECVD在InP衬底上低温沉积SiO / sub 2 /

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摘要

The low temperature deposition of SiO/sub 2/ thin films onto InP substrates is discussed. It is shown that the physical and chemical properties of SiO/sub 2/ thin films are stable over a three month period. X-ray photoelectron spectroscopy (XPS) analysis of the chemistry of the SiO/sub 2/-InP interface reveals the presence of an interfacial substrate oxide. The MIS C(V) characteristics exhibit low frequency dispersion and a deep depletion regime, but it is shown that the measurement procedure can significantly affect the fixed charge and interface state density determination.
机译:讨论了SiO / sub 2 /薄膜在InP衬底上的低温沉积。结果表明,SiO / sub 2 /薄膜的物理和化学性质在三个月的时间内是稳定的。 SiO / sub 2 / -InP界面化学性质的X射线光电子能谱(XPS)分析揭示了界面基质氧化物的存在。 MIS C(V)特性表现出低频色散和较深的耗尽状态,但表明测量程序会显着影响固定电荷和界面态密度的确定。

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