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The dependence of hot carrier degradation on AC stress waveforms

机译:热载流子退化与交流应力波形的关系

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The hot carrier degradation of submicron n-channel FETs is characterized for various gate and drain pulse waveforms. The results are consistent with interface electron traps generated by hot holes. The results showed that inverters with small loads can degrade faster than inverters with large loads, due to AC degradation effects. Device lifetime in circuits cannot in general be projected by DC data. The AC effect was also found to be dependent on device structure.
机译:针对各种栅极和漏极脉冲波形,对亚微米n沟道FET的热载流子退化进行了表征。结果与由热空穴产生的界面电子陷阱一致。结果表明,由于交流降级的影响,小负载的逆变器比大负载的逆变器能更快地降级。电路中的设备寿命通常不能通过DC数据来预测。还发现交流效应取决于器件结构。

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