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TCAD Analysis of the Four-Terminal Poly-Si TFTs on Suppression Mechanisms of the DC and AC Hot-Carrier Degradation

机译:四端聚-SI TFT对DC和AC热载体降解抑制机制的TCAD分析

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摘要

Four-terminal poly-Si thin-film transistors (TFTs), with a counter-doped body terminal connected to the floating channel, can suppress both dc and dynamic hot-carrier (HC) degradation of TFTs. With 3-D TCAD simulation, we clarify the underlying mechanisms of the suppression effect and analyze its dependence on the position and width of the body terminal. Under dc HC condition, a wider body terminal or that closer to the drain collects more holes generated from impact ionization in the drain depletion region and suppresses the parasitic bipolar junction transistor effect, subsequently reduces the kink current more effectively. Under dynamic HC condition, the body terminal injects holes at the end of the falling time of the gate pulse, partially removes the non-equilibrium state, significantly relieves the transient maximum electric field in the drain depletion region, thus suppresses the dynamic HC degradation. A wider body terminal can inject more holes and the holes injected by that closer to the drain diffuse to drain depletion region first, thus suppress the dynamic HC degradation better.
机译:具有连接到浮动通道的反掺杂主体端子的四端多Si薄膜晶体管(TFT)可以抑制TFT的DC和动态热载波(HC)劣化。通过3-D TCAD模拟,我们阐明了抑制效果的潜在机制,并分析了其对车身终端的位置和宽度的依赖。在DC HC条件下,更宽的主体终端或更靠近排水管的漏极收集从漏极耗尽区域中的碰撞电离产生的更多孔,并抑制寄生双极结晶体管效应,随后更有效地降低了扭结电流。在动态HC条件下,主体终端在栅极脉冲下降时间的末端注入孔,部分地去除非平衡状态,显着减轻漏极耗尽区域中的瞬态最大电场,从而抑制动态HC劣化。更宽的主体终端可以喷射更多的孔和通过更靠近漏极漫射的孔首先进入漏极漫射区域,从而更好地抑制动态HC劣化。

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