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Hot-carrier-induced degradation in reoxidized-nitrided-oxide n-MOSFETs under mixed AC-DC stressing

机译:混合AC-DC应力下热载流子引起的再氧化氮氧化物n-MOSFET的退化

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Reduced degradation rate can be observed for reoxidized-nitrided-oxide (RNO) n-MOSFETs under dynamic stressing versus the corresponding static stressing. A new degradation mechanism is proposed in which trapped holes in gate oxide are neutralized by the hot-electron injection, with no significant generation of interface states because of the hardening on the Si-SiO/sub 2/ interface by nitridation/reoxidation steps. The RNO device degradation during AC stressing arises mainly from the charge trapping in the gate oxide rather than the generation of interface states. Moreover, the AC-stressed RNO devices are significantly inferior to the fresh RNO devices in terms of DC stressing, possibly due to lots of neutral electron traps in the gate oxide resulting from the AC stressing.
机译:对于动态应力相对于相应的静态应力,再氧化氮氧化物(RNO)n-MOSFET可以观察到降低的降解速率。提出了一种新的降解机理,其中通过热电子注入中和栅氧化物中的空穴,由于通过氮化/再氧化步骤使Si-SiO / sub 2 /界面硬化,因此不会显着产生界面态。 AC应力期间的RNO器件性能下降主要是由于栅氧化物中的电荷俘获而不是界面态的产生。而且,在直流应力方面,交流应力的RNO器件明显不如新的RNO器件,这可能是由于交流应力导致的栅氧化层中大量中性电子陷阱所致。

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