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Diffusion and Aggregation of Mg Implanted in GaN on Si

机译:注入到GaN中的Mg在Si上的扩散和聚集

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We have studied the influence of thermal treatments on the redistribution of Mg implanted in GaN on Si. SIMS results highlights the strong effect of Mg concentration on its diffusion behaviour. In the range of 1018 at/cm3 or below, the Mg distribution is not modified after annealing up to 1100°C. In the order of 1019 at/cm3 or higher, such thermal treatment lead to fast diffusion of the implanted Mg in the [0001] direction and a trapping of the Mg at the GaN/capping layer interface. AFM analysis of the GaN surface after capping etching suggest that emerging dislocations are favourable diffusion path for Mg toward the GaN surface. APT analysis reveals that this diffusion behavior go-on with the formation of Mg rich clusters containing about typically a hundred atoms in our process conditions. This diffusion and aggregation behaviors are specific to the Mg specie and have to be taken into account to expect successful integration of p type doping process via Mg implantation in GaN on Si.
机译:我们已经研究了热处理对GaN中注入的Mg在Si上重新分布的影响。 SIMS结果突出了镁浓度对其扩散行为的强烈影响。在10的范围内 18 在/厘米 3 在1100℃以下,在1100℃以下进行退火后,Mg的分布没有变化。大约10 19 在/厘米 3 更高或更高的温度,这种热处理导致注入的Mg在[0001]方向上快速扩散,并导致Mg在GaN /帽层界面处捕获。覆盖蚀刻后的GaN表面的AFM分析表明,新出现的位错是Mg向GaN表面扩散的有利路径。 APT分析表明,在我们的工艺条件下,这种扩散行为随着富含Mg的团簇的形成而不断增加,该团簇通常包含约100个原子。这种扩散和聚集行为是特定于Mg物种的,必须考虑到这种情况,才能期望通过在Si上的GaN中进行Mg注入而成功集成p型掺杂工艺。

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