Thermal Stress Analysis of BGA Solder Joint Power Load Based on COMSOL

摘要

In this paper, the finite element analysis model of the solder joint of the ball grid array BGA (Ball grid array) is established, and based on the model, the welding point height and the maximum radial dimension of solder joint are studied by the finite element analysis of the power cyclic loading stress and strain of BGA solder joints. The effect of the diameter of the disc and the diameter of the lower pad on the stress and strain of the solder joint. The results show that the stress of solder joint decreases with the increase of weld point height, and decreases with the decrease of maximum radial size.