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Design and Simulation of 1800V 40A 4H-SiC SBD Using TCAD

机译:基于TCAD的1800V 40A 4H-SiC SBD的设计与仿真。

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摘要

Silicon carbide (SiC) is presenting as an attractive material for the next generation high voltage power devices which benefits from its excellent material properties. SiC Schottky barrier diode (SBD) compares with silicon based, which has superior characteristics in terms of rectification, reverse recovery time, etc. In this paper, a high voltage 4H-SiC SBD with reverse breakdown voltage of 1800 V and forward current of 40 A is designed as implemented in TCAD. The termination structure of the device is designed with multiple Field Limiting Rings (FLRs). The parameters of the active area and FLRs terminal protection structure are optimized. The steady state and transient characteristics of the device are simulated separately. As a result, the thickness of the N-type epitaxial layer is 16 μm and the doping concentration is 5.8×1015cm-3. Furthermore, the forward current is 40 A when the forward voltage is 1.60 V at room temperature. Finally, a temperature generation model is added to calculate the lattice temperature profile and analysis areas of possible failure during pulsed operation.
机译:碳化硅(SiC)由于其出色的材料性能而成为下一代高压功率器件的有吸引力的材料。 SiC肖特基势垒二极管(SBD)与基于硅的肖特基势垒二极管相比,在整流,反向恢复时间等方面具有优异的特性。在本文中,高压4H-SiC SBD的反向击穿电压为1800 V,正向电流为40 A是按照TCAD中的设计进行设计的。该设备的端接结构设计有多个场限制环(FLR)。优化了活动区域的参数和FLR的终端保护结构。分别模拟了器件的稳态和瞬态特性。结果,N型外延层的厚度为16μm,掺杂浓度为5.8×10 15 厘米 -3 。此外,在室温下,当正向电压为1.60 V时,正向电流为40A。最后,添加温度生成模型以计算晶格温度曲线并分析脉冲操作过程中可能发生的故障的区域。

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