Ceramic substrate technology for wafer level packaging of MEMS

摘要

The contribution deals with a new wafer level based packaging technology for MEMS. Wafer level packages have advantages compared to standard packaging technologies (miniaturization, cost reduction due to work in multiple panels, optimization of functional parameters). Ceramic packaging technologies offer additional advantages compared to established glass based wafer level packaging. Some examples are a multilayer substrate buildup, a possible integration of passive components (R, L, C) resp. of cavities or channels into the ceramic and a cost efficient manufacturing. The contribution will broach the technologies of ceramic substrate preparation, of component joining and will comment on the advantages of a ceramic solution.