MEMS package having capping member having different thickness, MEMS package having the same, MEMS wafer level package having the same, and method of manufacturing the same

摘要

Provided in the present invention is a MEMS package including a capping member which has a thin portion to provide a cavity having light transmittance and a deep depth useful to vacuum form and maintain, which has a thick portion useful to provide easy handling. According to an embodiment of the present invention, the MEMS package includes: a capping member including a basal portion, a window portion recessed from the top surface of the basal portion and a protrusion portion protruded from the top surface of the basal portion while surrounding the window portion; and a MEMS element member including a MEMS substrate attached with the capping member, and a MEMS element covered by the window portion while being surrounded by the protrusion portion.