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Improved on-resistance and breakdown voltage vertical GaN-based field effect transistors

机译:改进的垂直GaN基场效应晶体管的导通电阻和击穿电压

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GaN-based vertical field effect transistors (VFETs) are very promising in various power switching applications owing to their high current density and small chip size. However, it is still challenging to obtain high breakdown voltage (BV) and low on-resistance (R) in the practical VFETs. Design and simulation of the device structures are necessary in shortening the device development progress. In this paper, the GaN-based VFETs with AlGaN barrier layer and slanted gate structures are proposed and demonstrated by TCAD simulations. The concentration of the key p-GaN blocking layer is optimized. Improved performances with R of 0.47 mΩ·cm and BV over 450V are achieved in the proposed devices with the help of 2DEG channel design to increase the current conductivity and the slanted gate structure to reduce the peak electric field and hence increase the BV of the devices.
机译:基于GaN的垂直场效应晶体管(VFET)具有高电流密度和小芯片尺寸,因此在各种功率开关应用中非常有前途。但是,在实际的VFET中获得高击穿电压(BV)和低导通电阻(R)仍然是挑战。为了缩短器件开发进度,必须对器件结构进行设计和仿真。本文提出了具有AlGaN势垒层和倾斜栅极结构的GaN基VFET,并通过TCAD仿真进行了演示。优化了关键p-GaN阻挡层的浓度。借助2DEG通道设计来提高电流传导率,并通过倾斜的栅极结构来降低峰值电场,从而提高器件的BV,在所提出的器件中实现了0.47mΩ·cm的R和BV超过450V的改进性能。 。

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