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Improved on-resistance and breakdown voltage vertical GaN-based field effect transistors

机译:改进的导通电阻和击穿电压垂直GaN的场效应晶体管

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GaN-based vertical field effect transistors (VFETs) are very promising in various power switching applications owing to their high current density and small chip size. However, it is still challenging to obtain high breakdown voltage (BV) and low on-resistance (R) in the practical VFETs. Design and simulation of the device structures are necessary in shortening the device development progress. In this paper, the GaN-based VFETs with AlGaN barrier layer and slanted gate structures are proposed and demonstrated by TCAD simulations. The concentration of the key p-GaN blocking layer is optimized. Improved performances with R of 0.47 mΩ·cm and BV over 450V are achieved in the proposed devices with the help of 2DEG channel design to increase the current conductivity and the slanted gate structure to reduce the peak electric field and hence increase the BV of the devices.
机译:由于其高电流密度和小芯片尺寸,GaN基垂直场效应晶体管(VFET)非常有前途。然而,在实际VFET中获得高击穿电压(BV)和低电阻(R)仍然挑战。在缩短设备开发进度时,设备结构的设计和仿真是必要的。本文提出了具有AlGaN阻挡层和倾斜栅极结构的GaN的VFET,并通过TCAD模拟证明。优化键P-GaN阻断层的浓度。在2DEG通道设计的帮助下,在所提出的装置中,在所提出的装置中实现了0.47mΩ·cm和bv超过450v的r的性能,以增加电流电导率和倾斜的栅极结构以减少峰值电场,因此增加了设备的BV 。

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