Wafer-level non conductive films for exascale servers

摘要

Wafer-Level Non Conductive Films (WLNCFs) were evaluated as a potential underfill solution for future exascale server packages. The fundamental chip-joining ability and reliability on a small die package were tested. The fillet shapes, fillet overcoating, adhesion strength, and simplifications of the chip joining conditions, and the thermomechanical stresses in relation to the lower CTE substrate were evaluated and assessed for the future advanced packages.