chemical mechanical polishing; integrated circuit metallisation; moulding; printed circuits; solders; wafer level packaging; 2.5 D through silicon interposer package fabrication; CMP; CoW approach; Cu; PCB; UBM; backside rerouting layer; chemical mechanical polishing; chip-on-wafer approach; fine-pitch RDL; mechanical-grinding; over-mold encapsulation; polymer based dielectric; printed circuit board; semi-additive process; singulated packages; size 12 inch; size 300 mm; solder bumps; stacking-first approach; thick interposer substrate A wafer level molding process; under bump metallization; Assembly; Bonding; Polymers; Silicon; Substrates; Through-silicon vias;
机译:一种新型的中介层的制造和电学特性,该中介层具有用于2.5D / 3D应用的具有超低电阻率的直通硅通孔(TSV)的聚合物衬里和硅柱
机译:具有硅中介层的2.5D封装中的高频互连的设计,分析和测试
机译:硅中介层上模制多芯片的热增强型2.5D封装的研究
机译:2.5D通过芯片上晶圆(牛)方法的硅插入件包装制造
机译:MEMS传感器封装和TSV中介层封装的应力和变形最小。
机译:肥厚瘢痕处理的定制制造方法:3D印刷织物硅胶复合材料
机译:2.5D包装中间体机械应力的有限元分析