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Bondability and challenges of Cu ultra-fine-wire bonding

机译:铜超细线键合的可焊性和挑战

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Cu wire bonding has matured much over the years with improvements made not only to the Cu bonding process and optimization methodologies from bonder manufacturers, but also on capillaries and Cu wire itself. It is also part of the roadmap of many assembly houses to include ultra-fine-pitch(UFP) Cu wire applications. In this paper, various Cu wire types including coated Cu going down to as fine as 0.5mil diameter size is evaluated and compared in terms of Free-Air-Ball(FAB), 2nd bond performance in a customized QFP leadframe, 1st bond performance in a customized BGA substrate and extreme looping conditions at high and ultra-low loop are studied too. Challenges faced in Cu ultra-fine-wire(UFW) application will also be discussed. Improvement process through wire bonding parameters and making use of wire characteristics will also be covered. As wire diameter gets smaller, energy that is required to melt wire to form FAB also gets lower. Range of energy input in term of EFO Current and Firing Time also get smaller, and might be more sensitive towards noises from surrounding. Shorter Firing Time might also means less time to form concentric sphere before freezing. EFO firing approach gets more critical in this sense. Unlike gold wire that is malleable, copper wire is harder and hence does not deformed as easily. Limited by smaller capillary tip in UFP, 2nd bond contact area at UFW bonding also gets smaller. 2nd bond approach with segmented bonding was used to enhance the 2nd bond contact in this evaluation. UFP application with bond pad pitch down to as small as 30um has been reported in gold wire, however due to Cu FAB's harder nature, presence of Al splash in 1st bond posed a greater challenge in achieving this pitch with similar wire size made with Cu. Ease of bondability of CuPd has created a tendency to run CuPd wire as plug and playable wire to existing bare Cu wires. However difference observed in bonding response of CuPd from bare Cu means that slight fine tunin- in looping such as the kink location might still be required.
机译:多年以来,铜线键合已经非常成熟,不仅对键合机制造商的铜键合工艺和优化方法进行了改进,而且对毛细管和铜线本身也进行了改进。它也是许多装配厂路线图的一部分,其中包括超细间距(UFP)铜线应用。在本文中,我们评估了各种铜线类型,包括直径最小为0.5密耳的涂覆铜,并通过自由空气球(FAB),定制QFP引线框架中的第二键合性能,第一键合性能进行了比较。还研究了定制的BGA基板以及在高和超低环路时的极端环路条件。还将讨论铜超细丝(UFW)应用中面临的挑战。还将涵盖通过引线键合参数进行的改进过程以及利用引线的特性。随着线径变小,熔化线以形成FAB所需的能量也变低。以EFO电流和点火时间表示的能量输入范围也会变小,并且可能对周围的噪音更加敏感。较短的烧结时间也可能意味着在冻结之前形成同心球的时间减少。从这个意义上讲,EFO触发方法变得越来越关键。与可延展的金线不同,铜线更硬,因此不易变形。由于受到UFP中较小的毛细管尖端的限制,UFW粘结处的第二粘结接触面积也变小。在该评估中,采用分段结合的第二键方法来增强第二键的接触。据报道,金线中UFP应用的焊盘焊盘间距可小至30um,但是由于Cu FAB的较硬特性,在第一个键合中存在Al飞溅对以类似Cu尺寸的导线实现这一间距提出了更大的挑战。易于CuPd的粘结性已导致一种趋势,即CuPd线作为插头和可打线使用现有的裸Cu线。但是,从裸露的CuPd到CuPd的键合响应中观察到的差异意味着仍然可能需要轻微的微调回路,例如扭结位置。

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