首页> 外文OA文献 >Cu/Cu bonding and SiO₂/SiO₂ bonding by surface activated bonding at room temperature for hybrid bonding technique

【2h】

Cu/Cu bonding and SiO₂/SiO₂ bonding by surface activated bonding at room temperature for hybrid bonding technique

机译：Cu / Cu键合和SiO _{2 / siO _{2 通过表面活化键合在室温下进行混合粘合技术}}

代理获取

本网站仅为用户提供外文OA文献查询和代理获取服务，本网站没有原文。下单后我们将采用程序或人工为您竭诚获取高质量的原文，但由于OA文献来源多样且变更频繁，仍可能出现获取不到、文献不完整或与标题不符等情况，如果获取不到我们将提供退款服务。请知悉。

页面导航

著录项
引文网络
相似文献
相关主题

著录项

作者
Jun UTSUMI; Kensuke IDE;
展开▼
作者单位

展开▼
年度 2015
总页数
原文格式 PDF
正文语种
中图分类

相似文献

外文文献
中文文献
专利

1. Combined Surface Activated Bonding Technique for Low-Temperature Cu/Dielectric Hybrid Bonding [J] . He Ran, Fujino Masahisa, Yamauchi Akira, ECS Journal of Solid State Science and Technology . 2016,第7期

机译：低温铜/介电混合键合的组合表面活化键合技术
2. Cu-SiO2 hybrid bonding simulation including surface roughness and viscoplastic material modeling: A critical comparison of 2D and 3D modeling approach [J] . Wlanis Thomas, Hammer Rene, Ecker Werner, Microelectronics & Reliability . 2018,第JULa期

机译：Cu-SiO2杂化键合模拟，包括表面粗糙度和粘塑性材料建模：2D和3D建模方法的关键比较
3. Vapor-Assisted Surface Activation Method for Homo- and Heterogeneous Bonding of Cu, SiO_(2), and Polyimide at 150 deg C and Atmospheric Pressure [J] . AKITSU SHIGETOU, TADATOMO SUGA Journal of Electronic Materials . 2012,第8期

机译：气相辅助表面活化方法在150℃和大气压下实现Cu，SiO_（2）和聚酰亚胺的均相和异相键合
4. Combined Surface Activated Bonding Technique for Hydrophilic SiO_2-SiO_2 and Cu-Cu Bonding [C] . Ran He, Masahisa Fujino, Akira Yamauchi, PRiME Joint International Meeting of the Electrochemical Society, the Electrochemical Society of Japan, and the Korean Electrochemical Society . 2016

机译：亲水性SiO_2-SiO_2和Cu-Cu键合的组合表面活性粘合技术
5. Nano-Bonding of Silicon Oxides-based surfaces at Low Temperature: Bonding Interphase Modeling via Molecular Dynamics and Characterization of Bonding Surfaces Topography, Hydro-affinity and Free Energy [D] . Whaley, Shawn D. 2011

机译：低温下基于氧化硅的表面的纳米键合：通过分子动力学和键合表面形貌，亲和力和自由能表征的键合相模型
6. Cu-catalyzed cross-dehydrogenative coupling: A versatile strategy forC–C bond formations via the oxidative activation of sp3C–H bonds [O] . Zhiping Li, D. Scott Bohle, Chao-Jun Li 2006

机译：铜催化的交叉脱氢偶联：一种通用的策略通过sp3的氧化活化形成CC键碳氢键
7. Bonding Strength of Cu Sinter Die-Bonding Paste on Ni, Cu, Ag, and Au Surfaces under Pressureless Bonding Process [O] . Dai Ishikawa, Bao Ngoc An, Matthias Mail, 2020

机译：无压接合过程下镍锌烧结粘合浆料的Cu烧结粘合浆料的粘合强度

Cu/Cu bonding and SiO2/SiO2 bonding by surface activated bonding at room temperature for hybrid bonding technique

著录项

引文网络

相似文献

相关主题

期刊订阅

Cu/Cu bonding and SiO₂/SiO₂ bonding by surface activated bonding at room temperature for hybrid bonding technique