ball grid arrays; integrated circuit interconnections; system-in-package; three-dimensional integrated circuits; wafer level packaging; SiP integration; TEV; TSV; analytic expressions; application window; cost window; eWLB technology; electrical performance; electromagnetic simulations; embedded wafer level ball grid array technology; high-frequency system-in-package integration; through encapsulant via; through silicon via; vertical interconnections; Capacitance; Inductance; Resistance; Silicon; Substrates; Through-silicon vias; Transmission line measurements;
机译:TSV(硅通孔)对3D IC集成系统级封装(SiP)的热性能的影响
机译:考虑集肤效应,介电准TEM和慢波模式的用于3-D芯片集成和硅中介层的TSV的高频建模
机译:用于MMW 3-D封装系统前端模块的60 GHz频带铜球垂直互连
机译:垂直互连使用通过密封剂通孔(TEV)和通过硅通孔(TSV)进行高频系统 - 封装整合
机译:绝缘体电路上的高频混合信号硅设计,用于光学互连和通信。
机译:高电阻Si插入器的RF冗余TSV互连
机译:基于SI的系统内部设计,具有电子频段应用的宽带互连