Study on High Thermal Conductivity and Thick-Thin Film Hybrid Technology of AlN Substrate

摘要

With the trend of miniaturization high power and frequency of electronic devices, the higher performances of cooling, wiring density and lower loss for substrate have been required. Thick Film Circuits and Thin Film Circuits have their limitations on fine wiring and multilayer wiring respectively, which are difficult to simultaneously meet these requirements. In this study, thick-thin film hybrid AIN substrate with properties of high thermal conductivity, multilayer wiring and fine wiring has been researched. The thermal conductivity of AIN substrate has been improved to 190 W/mK by optimizing the preparation and it can content with the cooling requirements effectively. Thick-thin film hybrid technology is induced to meet high density wiring and lower loss. This kind of substrate can be used to High- Power T/R Module, High Speed Optical Transceiver Module and other fields.