Elastoplastic and fatigue properties of copper in printed circuit boards: from experimental characterization to numerical simulations

机译：印刷电路板中铜的弹性塑料和疲劳性能：从实验表征到数值模拟

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In operation, a Printed Circuit Board (PCB) will face various and repeated thermomechanical loadings that may lead to the failure of the copper, and thus to the malfunction of the PCB itself. In order to simulate and better predict the reliability of PCBs

机译：在操作中，印刷电路板（PCB）将面临各种和重复的热机械载荷，可能导致铜的故障，从而达到PCB本身的故障。为了模拟和更好地预测PCB的可靠性

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《International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems》|2020年|395p|共5页
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Gautier Girard; Marion Martiny; Sébastien Mercier;
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正文语种
中图分类自动模拟理论（自动仿真理论）;
关键词
Copper; Strain; Fatigue; Loading; Substrates; Load modeling; Plastics;

机译：铜;菌株;疲劳;装载;衬底;载荷建模;塑料;

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1. Experimental characterization of rolled annealed copper film used in flexible printed circuit boards: Identification of the elastic-plastic and low-cycle fatigue behaviors [J] . Girard Gautier, Martiny Marion, Mercier Sebastien Microelectronics & Reliability . 2020,第Deca期

机译：柔性印刷电路板中轧制退火铜膜的实验表征：弹性塑料和低循环疲劳行为的识别
2. Numerical Simulation and Experimental Measurement of a Printed Circuit Board Subjected to Drop Test [J] . Shiuh-Chuan Her, Shien-Chin Lan, Chun-Yen Liu, Key Engineering Materials . 2010,第期

机译：经受跌落测试的印刷电路板的数值模拟和实验测量
3. Experimental and numerical characterization of thin woven composites used in printed circuit boards for high frequency applications [J] . Girard Gautier, Jrad Mohamad, Bahi Slim, Composite Structures . 2018,第juna期

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4. Elastoplastic and fatigue properties of copper in printed circuit boards: from experimental characterization to numerical simulations [C] . Gautier Girard, Marion Martiny, Sébastien Mercier International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems . 2020

机译：印刷电路板中铜的弹塑性和疲劳特性：从实验表征到数值模拟
5. Microstructure and mechanical properties of electroless copper and their influence on the reliability of printed-circuit boards. [D] . Lin, Kuanchih. 1990

机译：化学镀铜的微观结构和机械性能及其对印刷电路板可靠性的影响。
6. Experimental and Numerical Simulations of 3D-Printed Polycaprolactone Scaffolds for Bone Tissue Engineering Applications [O] . Zhanyan Xu, Abdalla M. Omar, Paulo Bartolo 2021

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7. Experimental and numerical characterization of thin woven composites used in printed circuit boards for high frequency applications [O] . Gautier Girard, Mohamad Jrad, Slim Bahi, 2018

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Elastoplastic and fatigue properties of copper in printed circuit boards: from experimental characterization to numerical simulations

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