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Experimental and numerical characterization of thin woven composites used in printed circuit boards for high frequency applications

机译：用于高频应用的印刷电路板中使用的薄编织复合材料的实验性和数值表征

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Gautier Girard; Mohamad Jrad; Slim Bahi; Marion Martiny; Sébastien Mercier; Laurent Bodin; David Nevo; Sophie Dareys;
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1. Experimental and numerical characterization of thin woven composites used in printed circuit boards for high frequency applications [J] . Girard Gautier, Jrad Mohamad, Bahi Slim, Composite Structures . 2018,第juna期

机译：用于高频应用的印刷电路板中的薄编织复合材料的实验和数值表征
2. Effect of Temperature on Elastic Properties of Woven-Glass Epoxy Composites for Printed Circuit Board Applications [J] . Parsaoran Hutapea, Joachim L. Grenestedt Journal of Electronic Materials . 2003,第4期

机译：温度对印刷电路板应用的机织玻璃环氧复合材料弹性性能的影响
3. Multi-level modeling of woven glass/epoxy composite for multilayer printed circuit board applications [J] . Zhuo Chen, Fan Yang, S.A. Meguid International Journal of Solids and Structures . 2014,第21a22期

机译：用于多层印刷电路板应用的机织玻璃/环氧树脂复合材料的多级建模
4. Elastoplastic and fatigue properties of copper in printed circuit boards: from experimental characterization to numerical simulations [C] . Gautier Girard, Marion Martiny, Sébastien Mercier International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems . 2020

机译：印刷电路板中铜的弹塑性和疲劳特性：从实验表征到数值模拟
5. Hydrothermal processing of barium strontium titanate composites on printed circuit board for thin film varactor applications. [D] . Po, Justin. 2014

机译：用于薄膜变容二极管应用的印刷电路板上钛酸锶锶钡复合材料的水热处理。
6. Fabrication and Mechanical Characterization of Dry Three-Dimensional Warp Interlock Para-Aramid Woven Fabrics: Experimental Methods toward Applications in Composite Reinforcement and Soft Body Armor [O] . Mulat Alubel Abtew, Francois Boussu, Pascal Bruniaux, 2020

机译：干燥三维经线互联织物的制造和力学表征：复合加固和软体铠装应用的实验方法
7. Multi-level modeling of woven glass/epoxy composite for multilayer printed circuit board applications [O] . Chen Zhuo, Yang Fan, Meguid S.A. 2014

机译：用于多层印刷电路板应用的机织玻璃/环氧树脂复合材料的多级建模

Experimental and numerical characterization of thin woven composites used in printed circuit boards for high frequency applications

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