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Bulk Barrier Source-Gated Transistors with Improved Drain Current Dynamic Range and Temperature Coefficient

机译:容量屏障源门控晶体管,具有改善的漏极电流动态范围和温度系数

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Source-gated thin-film transistors (SGTs) have remarkable properties related to low-voltage amplification, tolerance to process variation and electrical stability. They rely on a potential barrier at the source in their operation, and usually this barrier is realized through a Schottky contact. Here, we study SGTs with source barriers made by doping the source region of the semiconductor to form bulk unipolar diodes (BUD). A BUSGT can have much higher drain current with a lower activation energy, resulting in higher switching speed and improved transconductance. Barriers made via doping also provide a wider range of barrier heights compared with Schottky contacts. We discuss design parameters for BUSGTs and compare these devices with SBSGTs.
机译:源门薄膜晶体管(SGT)具有与低压放大,对工艺变化和电稳定性的公差相关的显着性质。他们依靠源头的潜在障碍在他们的操作中,并且通常通过肖特基联系来实现这一屏障。这里,我们研究了通过掺杂半导体的源区制备的源屏障来形成散装单极二极管(芽)的SGT。 BUSGT可以具有更高的漏极电流,激活能量较低,导致开关速度较高和改进的跨导。与肖特基触点相比,通过掺杂制造的障碍也提供了更广泛的障碍高度。我们讨论BUSGTS的设计参数,并将这些设备与SBSGTS进行比较。

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