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Bulk Barrier Source-Gated Transistors with Improved Drain Current Dynamic Range and Temperature Coefficient

机译:具有改善的漏极电流动态范围和温度系数的体势垒栅门控晶体管

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Source-gated thin-film transistors (SGTs) have remarkable properties related to low-voltage amplification, tolerance to process variation and electrical stability. They rely on a potential barrier at the source in their operation, and usually this barrier is realized through a Schottky contact. Here, we study SGTs with source barriers made by doping the source region of the semiconductor to form bulk unipolar diodes (BUD). A BUSGT can have much higher drain current with a lower activation energy, resulting in higher switching speed and improved transconductance. Barriers made via doping also provide a wider range of barrier heights compared with Schottky contacts. We discuss design parameters for BUSGTs and compare these devices with SBSGTs.
机译:源极门控薄膜晶体管(SGT)具有与低压放大,对工艺变化的耐受性和电稳定性相关的显着特性。他们在操作中依赖于源头上的潜在障碍,并且通常通过肖特基接触来实现这一障碍。在这里,我们研究通过掺杂半导体的源极区以形成体单极二极管(BUD)而制成的具有源极势垒的SGT。 BUSGT可以具有更高的漏极电流,而激活能量更低,从而可以实现更高的开关速度和更高的跨导。与肖特基接触相比,通过掺杂制成的势垒还提供了更大范围的势垒高度。我们讨论了BUSGT的设计参数,并将这些设备与SBSGT进行了比较。

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