Ceramic column grid array (CCGA) package is an extension of the ceramic ball grid array (CBGA) package. The CCGA uses a column instead of a high melt ball to create a higher standoff and more flexible interconnect, and to achieve a significant increase in reliability. This paper introduced a technology of CCGA package with LGA717 substrate, it specifically discussed the coplanarity, the void rate and the solder joint strength. By design of the daisy-chain substrate, the board-level reliability of the CBGA and CCGA packages were investigated. The CCGA components had longer life than that of the CBGA components.
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