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机译:用于空间应用的陶瓷柱栅格阵列套装组件的焊料浸渍过程
Space Applicat Ctr Payload Elect Fabricat Div Ahmadabad 380015 Gujarat India;
Space Applicat Ctr Payload Elect Fabricat Div Ahmadabad 380015 Gujarat India;
Space Applicat Ctr Payload Elect Fabricat Div Ahmadabad 380015 Gujarat India;
Space Applicat Ctr Payload Elect Fabricat Div Ahmadabad 380015 Gujarat India;
Space Applicat Ctr Payload Elect Fabricat Div Ahmadabad 380015 Gujarat India;
Space Applicat Ctr Payload Elect Fabricat Div Ahmadabad 380015 Gujarat India;
Space Applicat Ctr Payload Elect Fabricat Div Ahmadabad 380015 Gujarat India;
Ceramics; Soldering; Reliability; Printing; Integrated circuit interconnections; Process control; Inspection; Assembly; ceramic column grid array (CCGA); paste deposition; prototyping; rework; solder immersion process (SImP);
机译:陶瓷柱状网格阵列(CCGA717)互连封装在极端温度下的航天应用可靠性
机译:陶瓷柱网格阵列封装振动引起的焊点失效的分析与预测
机译:PCBS(印刷电路板)上带有95.5SN3.9AG0.6CU无铅焊膏的1657CCGA(陶瓷列栅阵列)封装的可靠性
机译:新型陶瓷柱网格阵列组件的组装和返工过程调查
机译:锡铅和无铅陶瓷柱网格阵列封装的热机械性能。
机译:增材制造的薄网的绿色加工产生的陶瓷骨垫片的生物响应
机译:球栅阵列(BGa)/列栅阵列(CGa)组件的预测应力,其末端采用低模量焊料