An enhancement of bga technology meets the challenges of long life, extreme thermal and mechanical conditions, the use of large components, the need for ultra-high reliability. With the ever-increasing capabilities of integrated circuits have come the requirements on electronic packaging for providing higher density, higher I/O and higher performance. For most commercial applications, these requirements have been addressed through the implementation of ball grid array (BGA) packaging. Area array components provide many times more the number of I/O than peripheral lead packages, such as quad flat packs, leadless chip carriers and small outline J-leaded packages.
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